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SMT Real Z 3000A 2D SPI Solder Paste Height Test , Thickness Tester Assembly Equipment

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SMT Real Z 3000A 2D SPI Solder Paste Height Test , Thickness Tester Assembly Equipment

Country/Region china
City & Province suzhou jiangsu
Categories Electronics Production Machinery
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Product Details

SMT Real Z 3000A 2D SPI Solder Paste Heig Solder paste thickness tester Assembly Equipment

 

 

Parameter:

Measurement principle:Relative method, grating ruler as the benchmark
Resolution:0.001 mm
Absolute accuracy:≤0.003%
Repeatability accuracy:≤0.01%
green copper and copper foil of Error compensation:yes
Eliminate deformation error of PCB:yes
Range:30 mm
Optical magnification:50 - 360X continuous stepless zoom
Field:10 x 7.5 - 1.2 x 0.8 mm adjust according to demand
Maximum size of PCB:400 x 600 mm
Minimum measurable element:0201, 01005, 0.2mm, fine pitch IC, BGA/CSP
Light color:White, green, blue and turn off can be switched
Lighting life:More than 1 million hours (LED power)
Laser wavelength and power:650nm, micropower <5mW
Laser lifetime:5-10 times longer than a laser without a standby function
Video output interfaceL:USB
Video resolution:640 x 480 (can choose 1280x960)
Video total pixel:1 million 300 thousand pixels
Video type:color image
Multiple line sharing: yesyes
SPC statistical function:Bad judgment, average value, standard deviation, Cpk, bad rate, distribution chart, trend chart, X, bar-R control chart, etc.
Power and power dissipation:Through USB interface power supply, 2.5W small power consumption
Hot swap:yes (Power failure without loss of measurement data)
Weight and size:60kg, W600 x D550 x H650 mm
  • Benefits

1. Allows the offset of the printing screen to the PCB at full scan

2. Color camera system, available to inspect different colors and lighting angles.

3. Excellent price / performance ratio

4. Low maintenance effort, because a closed system and no large masses must be moved

5. Low system costs and high system availability.

 

  • Measurement Theory

Project the precise laser into the object surface in 1 particular angle, because of the height difference between object surface and its base, the laser line will generate distance on object surface and its base. Capture the image with the optical system with microscope and digital CCD camera, and then analyze with computer software and then it can calculate the real height of the object.

 

  • Application

Solder Paste height measurement

Area / Volume measurement.

PCB Printing, Solder Paste , Solder mask, Circuit height, paint height size and height measurement.

Geometry, X, Y size, Angle, Surface etc measurement.

Video Capture S.P.C Analysis.

 

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