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JUKI Pick And Place Smd Pcb Aoi Machine Detector SZ-X3 Material On Silver Rail

Shenzhen Wanbo Hi-Tech Co., Ltd.
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Address: Fuyong Xinhe Sanqu, 7 Xiang 12 Hao 102, Bao'an, Shenzhen, Guangdong, China

Contact name:Su Zhongqiu

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Shenzhen Wanbo Hi-Tech Co., Ltd.

JUKI Pick And Place Smd Pcb Aoi Machine Detector SZ-X3 Material On Silver Rail

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

JUKI pick and place smd machine Detector AOI SZ-X3 material on silver rail
AOI Inspection Machine SZ-X3 detects positive and negative polarity Welding
DIP line consists of plug-in machines wave soldering AOI main equipment etc
Plug-in machine production DIP offline AOI SZ-X3 check PCB size Max430×330mm
Offline Machine AOI SZ-X3 post welding electronic board short circuit check
Off-line AOI SZ-X3 software function Image comparison has a high pass rate
AOI Inspection Machine SZ-X3 detects chip element 01005 virtual soldering
AOI Inspection Machine SZ-X3 is missing and skewed after wave soldering
AOI SZ-X3 software function CAD data import makes programming convenient

 
Shenzhen Wanbo Hi-Tech Co., Ltd. is a professional electronic equipment manufacturer integrating R&D, production and sales, producing: AOI testing equipment, AI plug-in machine, wave soldering, reflow soldering, connection platform, automatic loading and unloading machine, stacking machine, corner machine and other equipment; The warehouse has second-hand equipment: Panasonic placement machine, Yamaha placement machine, JUKI placement machine, Samsung placement machine, domestic EZ-pass placement machine, domestic platform machine placement machine, printing machine, reflow soldering and other supporting equipment; The warehouse has accessories: motors, boards, laser heads, accessories FEEDER, nozzles, etc.
 
The function of AOI testing equipment is to detect PCBA board control defective products.
After the wave soldering of the DIP plug-in: more tin, less tin, tin hole, short circuit, pin not out, etc.
After SMT furnace: missing parts, misalignment, wrong parts, polarity reverse, breakage, pollution, less tin, more tin, short circuit, virtual soldering, etc.
Equipment separation line machine and online machine.
Offline models: X1 detection patch products, X3 detection plug-in products;
Online models: X5 camera photo detection patch products, X6 camera photo detection plug-in products.
 
1. AOI principle: use modern optical principles and digital camera technology to shoot the detected object in real time, analyze and process the captured image through computer and special software, and automatically generate detection results.
2. AOI function: AOI effective detection rate: more than 99% (manual detection rate: about 70%);
Reduce labor: 2-4 people/production line, high detection efficiency;
Through the SPC function, the process defects can be accurately counted and can be effectively controlled;
The stability is much higher than that of labor, long-term use, the comprehensive cost can be significantly reduced;
It can enhance the company's comprehensive strength and effectively improve the company's overall competitiveness.
 
SMD is the abbreviation of Surface Mounted Devices, which means: surface mount device, it is SMT (Surface Mount
Technology) components, including CHIP, SOP, SOJ, PLCC, LCCC, QFP, BGA, CSP, FC, MCM and so on.
Surface mount components were introduced about two decades ago and ushered in a new era. From passive components to active components and integrated circuits,
The end result is a surface mount device (SMD) that can be assembled via pick-and-place equipment.
For a long time, it was assumed that all lead components would eventually be available in SMD packages.
SMT is the abbreviation of Surface Mount Technology, which means: surface assembly technology, which is currently the most popular technology and process in the electronics assembly industry.
SMT is a new generation of electronic assembly technology, which compresses traditional electronic components into devices that are only a few tenths of the size.
As a result, electronic product assembly is realized with high density, high reliability, miniaturization, low cost, and production automation.
This miniaturized component is called: SMD device (or SMC, chip device). The process method of assembling components onto a printed board PCB is called the SMT process.

 

What is the difference between SMT and DIP? SMD patch DIP plug-in
SMT patch refers to the abbreviation of a series of processes processed on the basis of PCB, and PCB (Printed Circuit Board) is a printed circuit board.
SMT stands for Surface Mount Technology (Surface Mount Technology) (short for Surface Mounted Technology),
It is one of the most popular technologies and processes in the electronics assembly industry.
Of course, when you say SMT, the SMD patch that you refer to should not include DIP devices, so it can be said that SMT is a patch and DIP is a through-hole plug-in process,
As shown in the figure below, the difference between devices and processes, usually SMT (SMD) process is to use reflow soldering to complete soldering,
DIP usually uses wave soldering or fully automatic dip welding machine to complete the welding!


Device parameters and configuration

Functional Specifications
Tested circuit boardSMT reflow furnace pre-reflow furnace, post-circuit board inspection, wave soldering pre-soldering, wave soldering post-circuit board inspection
Detection methodColor extraction, statistical modeling, full-color image comparison, automatic setting of parameters according to different detection points (such as offset, polarity, short circuit, etc.)
CameraFull color smart digital camera
Resolution/Visual Range/Speed

Optional: 25μm/Pixel FOV: 40.70mm X30.90mm Detection speed< 270ms/FOV
Standard: 20μm/Pixel FOV: 32.56mm×24.72mm Detection speed<260ms/FOV
Optional: 15μm/Pixel FOV: 24.42mm X18.54mm Detection speed< 240ms/FOV
Optional: 10μm/Pixel FOV: 16.28mm X12.36mm Detection speed< 220ms/FOV

light sourceHigh brightness RRGB coaxial ring tower LED light source (color light)
Programming modeManual writing, automatic framing, CAD data import and automatic correspondence libraries
Remote controlRemote operation, viewing, starting or stopping machine running, modifying programs, etc. anytime, anywhere, anytime, anywhere through TCP/IP network
Barcode systemAutomatic camera recognition and transmission of Barcode (1D or 2D code), and multi-Mark function (including Bad Mark)
Server modeUsing a central server, several AOI data sets can be centrally managed
operating systemWindows7 Professional
Check the result output22 inch LCD monitor
System Specifications
PCB size range50×50mm(Min)~430×330mm(Max)
PCB thickness range0.3 to 5 mm
PCB clamping system edge clearanceTOP:3.5 mm Bottom:3.5 mm
Maximum PCB weight3KG
PCB flex<5mm or 2% of PCB diagonal length
PCB top and bottom net heightPCB Top Side: 30 mm PCB Bottom Side: 60 mm
Conveyor systemAutomatic opening and retracting of bilateral fixtures, automatic compensation of PCB bending deformation
Conveyor height above the ground850 to 920 mm
Conveyor flow / timePCB moves in Y direction In/out time: 2.5 seconds
X/Y platform driverScrew motor driven, positioning accuracy < 20μm; The PCB is fixed and the Camera moves in the X direction
Power supply/air pressureAC230V 50/60 Hz less than 1KVA / not required
Device weightAPPROX. 350KG
Device form factor1070×900×1310mm (L×W×H)
Ambient temperature and humidity10~35°C 35~80% RH (non-condensing)
Equipment safetyComplies with CE safety standards
 

 

 

 
Tip: The missing frame of the resistor is the same detection frame as the wrong part frame, which mainly detects silk screening.
 
 
 

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