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10 Layers Interconnect HDI PCB Manufacturer Printed Circuit Boards

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Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103

Contact name:Helen Jiang

Shenzhen KAZ Circuit Co., Ltd

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10 Layers Interconnect HDI PCB Manufacturer Printed Circuit Boards

Country/Region china
City & Province shenzhen guangdong
Categories Multilayer PCB

Product Details

10 Layers Interconnect HDI PCB Manufacturer Printed Circuit Boards
 


Detail Specifications:

 

 Layers 10
 Material FR-4
 Board Thickness 1.6mm
 Copper Thickness 1oz
 Surface Treatment ENIG 1u"
 Soldmask & Silkscreen Green & White
 Quality Standard IPC Class 2, 100% E-testing
 Certificates TS16949, ISO9001, UL, RoHS

 
 

More Photo of this 10 Layers Interconnect HDI PCB Manufacturer Printed Circuit Boards
 

 
What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP

 
To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)

 
Company Informaiton:
 
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
 
Manufacturer Capacity:
 

 Capacity Double Sided: 12000 sq.m / month
 Multilayers: 8000sq.m / month
 Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
 Board Thickness 0.3~4.0mm
 Layers 1~20 layers
 Material FR-4, Aluminum, PI
 Copper Thickness 0.5~4oz
 Material Tg Tg140~Tg170
 Max PCB Size 600*1200mm
 Min Hole Size 0.2mm (+/- 0.025)
 Surface Treatment HASL, ENIG, OSP

 

SMT Capacity

 

Assembly LinesEquipmentsFit Components SizesFit PCB SizesSupported ComponentsTheoretical CPHFit for Products
MinMaxMinMaxChipIC
1

DSP-1008+YS24+

YV100XGP+YG12F+JT NS1000

0.2×

0.1mm

50×

50mm
Pitch=

0.2mm

50×

50mm

410×

460mm

200 Tape
20 Tray
1100003300Phone, Motherboard, Industrial Control board, Laptop, GPU, etc.
2

DSP-1008+MX200+MX200+

MX200+MX200P+JT NS1000

0.4×

0.2mm

45×

150mm

50×

50mm

410×

460mm

280 Tape

22 Tray

750001200Motherboard,
Laptop,
small&medium GPU, etc.
3

DSP-1008+MX400+MX200+

MX200+MX200P+JT NS1000

0.4×

0.2mm

50×

50mm

50×

50mm

410×

460mm

280 Tape

20 Tray

1070001200
4

DSP-1008+MX400+MX200+

MX200+MX200P+JT NS1000

0.4×

0.2mm

50×

50mm

50×

50mm

410×

460mm

280 Tape

20 Tray

1070001200
5

JKD600AA+

MX200+MX200P

0.4×

0.2mm

45×

150mm

50×

50mm

410×

460mm

120 Tape

22 Tray

350001200General Digital Products, small & medium cardboard BOT

 

 

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