Active Member
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[China]
Address: 4/F XingYuan Technology Park,Gushu Tongda Road ,Xixiang Town,Baoan District,Shenzhen,China,518102
Contact name:Victor Zhang
Shenzhen Leadsintec Technology Co., Ltd |
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Electronic SMT PCBA Assembly Through Hole Gold Plating ISO9001
Shenzhen Custom Printed Circuit Board Manufacturer, Electronic PCB SMT/DIP PCBA Assembly
Our advantage | ||||
Material Technology | Our Production | General Production | ||
Regular/Special | 1. Our (TG170)FR4: high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2. Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3. Our CEM no-burr 4. Our Rogers Good performance in high frequency 5. Our Aluminum Excellent heat dispersion | 1.General FR4 High heat work 2.General CEM Expand and deform in damp conditions | ||
Factory | We have automatic production line. The automatic production line
improves the precision and efficiency of PCB production,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost. | Artificial production line | ||
Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume
of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost | ||
Impedance | Good performance in reliability and stability of signal sending and
receiving | High cost | ||
Surface Technics | 1. IMG: smooth surface, good adhesion, no oxidation under long
using 2. gold plating(thick gold:1-50U"):good wear-resistance 3. HASL: better price, not easy oxidation, easy to welding, smooth surface 4. HAL: better price, not easy oxidation, easy to welding | 1. IMG:high price 2. Gold plating(thick gold):high price 3. HAL:surface is not flat, not suitable for BAG packaging | ||
Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM | ||
Multilayer board(4-20 L),BGA(CPU) | BGA:high density, high performance, multifunctional, increase
thermal reliability, good performance in electro heat property, MIN width/space: 3/3MIL Multilayer board:strong microporous, high reliability | Difficult manufacturer,high cost | ||
Test | To assure quality, avoid wasting after installing and scraping,
save cost, save the time of rework | Careless | ||
