Home Companies SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED

1.8mm Tower Type LED Lamps, LED Lamps, DIP LED , LOW POWER LED,INDICATED LED

Active Member

Contact Us

[China]

Address: 603, HAIZHEN BUILDING,SHANGXING SOUTH ROAD,SHAJING SUB-DISTRICT,BAOAN DISTRICT, SHENZHEN,CHINA

Contact name:TONY

SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED

1.8mm Tower Type LED Lamps, LED Lamps, DIP LED , LOW POWER LED,INDICATED LED

Country/Region	china
City & Province	shenzhen guangdong

Product Details

SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED professional manufacture SMD LED for 10 years with good quality and best performance. Our products include 0603 0805 1206 3528 5050 etc.

3MM TOWER TYPE LED LAMPS

Features:

(1)suitable for all SMT asembly methods.
(2)compatible with infrared and vapor phase reflow solder process.
(3)compatible with automatic placement equipment.
(4)This product doesn't contain restriction substance,comply ROHS standard.

Applications:

Turn singals
Status indicators:comsumer & industrial
Backlighting:LCDS,Key pads adverstising
General use

Package Dimensions:

Electrical and optical characteristics(Ta=25Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)C)

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Luminous Intensity	Iv	50	---	80	mcd	If=20mA (Note 1)
Viewing Angle	2θ1/2	---	120	---	Deg	(Note 2)
Dominant Wave Length	p	560	565	570	nm	IF=20mA (Note 3)
Forward Voltage	VF	1.9	2.0	2.4	V	IF=20mA
Reverse Current	IR	---	---	100	µA	VR=5V

Soldering

Reflow soldering

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)

Dip soldering(wave soldering)

Preheating:120°C-150°C, within 120-180 sec

Operation heating:245°C±5°C within 5 sec.260°C(MAX)

Gradual cooling(Avoid quenching)

Reliablity test items and conditions:

The reliablity of products shall be satisfied with items listed below.

Confidence level:97%

LTPD:3%

NO	Item	Test Conditions	Test Hours/Cycle	Sample Size	Failure Judgment Criteria	AC/RE
1	Solder Heat	TEMP:260°C±5ºC	10 SEC	76pcs	IV≦Ivt*0.5 or VF≧U or VF≦L	0/1
2	Temperature Cycle	H:+100ºC 15min L:-40ºC 15min	300 CYCLES	76pcs		0/1
3	Thermal Shock	H:+100ºC 5min~10sec L:-10ºC 5min	300 CYCLES	76pcs		0/1
4	High Temperature Storage	TEMP:100°C	1000HRS	76pcs		0/1
5	Low Temperature Storage	TEMP:-40°C	1000HRS	76pcs		0/1
6	DC Operating Life	TEMP:25°C If=20MA	1000HRS	76pcs		0/1
7	High Temperature/High Humidity	85ºC /85℅RH	1000HRS	76pcs		0/1

Note:Ivt:To test Iv value of the chip before the reliablility test

Iv:The test value of the chip that has completed the reliablility test

U: Upper specifications Limit

L: Lower specifications Limit