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Customization size 3.5mm thickness silicon cushion for card laminating

Wuhan Wenlin Technology Co. Ltd
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Address: Head Office: No.18 Renhai Villa, China Courtyard, Panlong City, Wuhan, China

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Wuhan Wenlin Technology Co. Ltd

Customization size 3.5mm thickness silicon cushion for card laminating

Country/Region china
City & Province wuhan hubei
Categories Other Office & School Supplies
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Product Details

Customization size 3.5mm thickness silicon cushion for card laminating

 

Product parameter:

  1. Facing material:High-temperature endurable felt
  2. Middle material:Black silica gel
  3. Rigidity:50±5
  4. Tensile strength(N/mm):60
  5. Adhesion N/mm:4.5
  6. Heat-resistant t (℃):200
  7. Color:White

Description:

Raw materials are all for anti-high temperature and anti-high pressure. Meeting the requirements of laminating process, as the professional card consumables, they have been widely using for improving the production efficiency and saving energy because of the feature of thermal conductive fast and uniform. Have excellent bibulous performance, can effectively eliminate the risks of bubbles and watermarks on card surface, greatly improved the qualification rate of products, and with good cushioning properties, they can avoid the scratches linked to the hard touching between the heating plate and the trays, benefited to the long using life of above both.

 

Application:

Laminating pads are suitable for manufacturing kinds of ISO baning cards, cards and smart cards.

 

 

 

 

 

 

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