Guangdong Taijin Semiconductor Technology Co., Ltd |
Verified Suppliers
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Semicon Molding Device
【Features】
● Semiconductor plastic sealing equipment is also known as full-automatic plastic sealing machine, automatic plastic sealing of chips, semiconductor devices and other products.
● Full servo control system, PLC (OMRON) + upper computer;
● WIN10 + 15-inch touch screen + touch keyboard.
● CCD image detection, feeding anti-reverse detection
● Standardized mold structure, convenient replacement;
● High-efficiency cake loading component, aluminum cassette loading;
● Support flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● Automatic cassette loading, double cassette stacked loading;
● Optionally equipped with mold vacuum function, isolation mold function, and detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, quality assurance;
● Customized according to needs, no worry after-sales.
Performance Parameters
● Closing pressure: 98-1764kN;
● Injection pressure: 4.9-29.4kN adjustable;
Applicable leadframe/substrate size: 20-90mm wide, 124-300mm long;
● Applicable plastic sealing material size: diameter φ 11-20mm, length 12-35mm;
Technical Parameters | Value |
---|---|
Screw Diameter | 35 mm |
Model | SM-1000 |
Clamping Force | 1000 KN |
Platen Size | 600 x 600 mm |
Cooling System | Water |
Max. Mold Height | 400 mm |
Capacity | 100 tons |
Type | Vertical Injection Molding Machine |
Injection Pressure | 200 MPa |
Heating Power | 12 KW |
Product Features | Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Heating Power: 12 KW
Control System: PLC
Clamping Force: 1000 KN
Max. Mold Height: 400 Mm
Type: Vertical Injection Molding Machine
The Semiconductor Molding Machine from TJIN is a highly efficient and advanced machine designed specifically for the molding of semiconductor materials. It is suitable for use in various industries such as electronics, automotive, and medical.
The machine is carefully packaged in wooden packaging to ensure safe transportation. It can be delivered within 40 days after placing the order, making it an ideal choice for customers with urgent production needs.
To place an order for the Semiconductor Molding Machine from TJIN, please contact us with your specific requirements and we will provide you with a competitive quote. The minimum order quantity is 1 machine, and payment can be made via TT.
Experience the precision and efficiency of the TJIN Semiconductor Molding Machine and take your production to the next level. Contact us today!
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT