Active Member
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[China]
Address: Address: North 1st Rd,No.3,Chikan district,Shipai town, 523346 Dongguan City, China
Contact name:Charlotte
Dongguan ShuangYi Electronic Technology Manufacturing co., LTD |
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Technical details:
The Serial Attached SCSI standard defines several layers (in order from highest to lowest): application, transport, port, link, PHY and physical. Serial Attached SCSI comprises three transport protocols:
Serial SCSI Protocol (SSP) – for command-level communication with SCSI devices.
Serial ATA Tunneling Protocol (STP) – for command-level communication with SATA devices.
Serial Management Protocol (SMP) – for managing the SAS fabric.
For the Link and PHY layers, SAS defines its own unique protocol.
At the physical layer, the SAS standard defines connectors and voltage levels. The physical characteristics of the SAS wiring and signaling are compatible with and have loosely tracked that of SATA up to the 6 Gbit/s rate, although SAS defines more rigorous physical signaling specifications as well as a wider allowable differential voltage swing intended to allow longer cabling. While SAS-1.0 and SAS-1.1 adopted the physical signaling characteristics of SATA at the 3 Gbit/s rate with 8b/10b encoding, SAS-2.0 development of a 6 Gbit/s physical rate led the development of an equivalent SATA speed. In 2013, 12 Gbit/s followed in the SAS-3 specification. SAS-4 is slated to introduce 22.5 Gbit/s signaling with a more efficient 128b/150b encoding scheme to realize a usable data rate of 2,400 MB/s while retaining compatibility with 6 and 12 Gbit/s/.
Additionally, SCSI Express takes advantage of the PCI Express infrastructure to directly connect SCSI devices over a more universal interface.
Specification:
1. Poles: 29pin |
2. Withstand Voltage: 500VAC/minute |
3. Avaiable: 7Circuits |
4. Contact Resistance: 30mΩ(MAX) |
5. Pitch Between Poles:1.27mm |
6. Insulation Resistance:1000MΩ(MAX) |
7. Rated Voltage: 40VAC |
8. Temperature Range: -20°--+85° |
9. Rated Current:1.5A |
10. Aplicable Wire Range: AWG #18-#30-#30 |
11. Operating temp: -55~105 |
Material:
1. Terminal: Phosphor Bronze, Gold Plated |
2. Housing: LCP+GF |
3. Insulation:LCP/BPT G/F 94V-0 |
4. Termial:Copper Alloy |
5. Ni 50u'' Min Plated over Terminal |
6. Au Plated on contact Area |
7. Tin 80u''Min Plated on solder&crimp Area |
8. Shell: Copper Alloy |
9. Plated Su 80 u on Contact Area |
10: Ni 40u Plated over shell |
Mechanical:
1. Insertion Force: 45N max |
2. Withdrawal Force: 10N min |
Applications:
Products are widely used in computers, laptops, mobile phones, communications, medical and electrical equipments.
