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150mm LED Sapphire Substrate , Scratch Resistant Sapphire Crystal

Chongqing Silian Optoelectronic Science & Technology Co., Ltd.
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Address: No.99 Tong Xi Road, Caijia Town, Beibei District, Chongqing,China

Contact name:Wu

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Chongqing Silian Optoelectronic Science & Technology Co., Ltd.

150mm LED Sapphire Substrate , Scratch Resistant Sapphire Crystal

Country/Region china
City & Province chongqing chongqing
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Product Details

Different sizes of high-quality LED sapphire substrates

 

 

Product Description

The composition of sapphire is alumina (A12O3), which is covalently bonded by three oxygen basals and two aluminum basals. The crystal structure is a hexagonal lattice structure. The optical penetration band of sapphire is very wide, from near ultraviolet light. (190nm) to mid-infrared rays have good light transmittance, and have the characteristics of high sound velocity, high temperature resistance, corrosion resistance, high hardness, high melting point (20452 degrees C), etc., and are often used as optoelectronic component materials. The quality of ultra-high-brightness white/blue LED depends on the material quality of gallium nitride epitaxy (GaN), so it is related to the surface processing quality of the sapphire substrate used. The lattice constant mismatch rate between the VI-deposited films is small, and it meets the high temperature resistance requirements of the GaN epitaxy process. Therefore, the sapphire substrate has become the key material for the production of white/blue/green LEDs.

 

Technical Specification

 

Wafer Surface OrientationC-axis [0001] 0.35°
Mis-Orientation Towards Notch

-0.10° to 0.10°

Mis-Orientation Clockwise 90° from Notch0.35° ± 0.10°
Notch OrientationM-plane (-1 1 0 0)
Diameter150.0mm ± 0.20mm
Thickness1.30mm ± 0.02mm
Notch Misalignment-0.3° to 0.3°
GBIR≤ 15um
SBIR≤ 3um
Front Side Bow-15 to 15um
Front Surface FinishEPI Ready per INGN-0144
Backsurface

Average Roughness: 0.65 to 0.95um

Range of Roughness: 0.4um

Frontside Wafer ID

Wafer ID on front surface per SEMII T5-96

Text: MCXXXXXNNN-YZ

MC: Silian 150mm wafer with 0.35 mis-orientation toward a-axis

XXXXX: Clean Lot ID

NNN: Wafer Number

YZ: Checksum

Bevel Dimensions

Front Bevel Size: 50 to 150um

Back Bevel Size: 50 to 200um

Front Bevel Angle: 35 to 55 degree

ROA (at 0.5mm)-1 to 1um
Surface DefectsPLLC 5183.0699 HC Candela Upper Spec Limits
Packaging:Class 100 clean room environment, in cassettes of 25, under a nitrogen atmosphere.

 


 

Product advantages

 

Pattern Sapphire Substrate (PSS): The sapphire substrate is designed to produce nano-scale specific regular microstructure patterns by growth or etching to control the output light form of the LED. At the same time, it can reduce the defects of the GaN grown on the sapphire substrate, improve the quality of the epitaxy, and improve the internal quantum efficiency of the LED and increase the light extraction efficiency.

It has the characteristics of high sound velocity, high temperature resistance, corrosion resistance, high hardness, high light transmittance, high melting point (2045°C), etc.

 

 

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