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Closed Field Unbalanced Magnetron Sputtering System, CE Certified PVD Ion Plating Machine

SHANGHAI ROYAL TECHNOLOGY INC.

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Address: 819# SONGWEI ROAD (N.) SONGJIANG INDUSTRIAL ZONE, SHANG HAI, CHINA 201613

Contact name:ZHOU XIN

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SHANGHAI ROYAL TECHNOLOGY INC.

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Closed Field Unbalanced Magnetron Sputtering System, CE Certified PVD Ion Plating Machine

Country/Region china
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Product Details

 

               Closed field unbalanced magnetron sputtering deposition system, Unbalanced Magnetron Sputtering Ion Plating

 

 

 

Unbalanced and closed field magnetron processes have all the advantages of planar magnetrons. Additional advantages and disadvantages are:

  • Additional ion bombardment resulting in dense, adherent films
  • Ion assist and substrate cleaning possible
  • Improved tribological, wear and corrosion resistant films
  • Amenable to multilayer, superlattice, nanolaminant and nanocomposite films
  • Poorer materials usage
  • More complex cathode configuration/expense

Unbalanced and closed field magnetron sputtering revolutionized properties achievable by magnetron sputtering processes. As successful with improved thin film tribological, corrosion resistance and optical properties as this technology was, improvements in magnetron technology had just begun. Next Blog we move onto rotating and cylindrical magnetron processes and resulting thin film applications.

                            --- Above Artical from  P E T E R       M A R T I N

 

Royal technology developed high yield and high target utilization sputtering cathodes, especially for rare and expensive metals sputtering:  Au Gold, Ta  Tantalum,  Ag silver metal films deposition.   The high uniformity film's deposition system have been serving several industries like Electronics parts, medical instruments components which require high film uniformity, multiple layers deposition. 

 

 

The RTSP1000 machine is a standardized machine developed by Royal technology. Extensive applied with cutting/forming tools, molds, medical  instruments, electronics components, automotive industries. 

 

RTSP1000 Main Configurations and Technical Parameters 
MODEL RTSP1000
TECHNOLOGY MF magnetron sputtering + ion source plasma cleaning
CHAMBER MATERIAL Stainless Steel (S304)
CHAMBER SIZE Φ1000*800mm (H)
CHAMBER TYPE D shape
ROTATION RACK & JIG SYSTEM 6 satellites Max. weight: 500kgs
POWER SUPPLIES 

Qty. of Sputtering: 2*24 KW Bias of Power Supply: 1*20W Ion Source Power supply 1*5KW

DEPOSITION MATERIAL Ti/Cr/TiAl /Ta/Cu/Au/Carbon etc. 
DEPOSITION SOURCE  2 pairs (4 pieces) Planar Sputtering Cathodes +
1 Linear Ion Source
Uniformity Area: ±10~15%
CONTROL  PLC(Programmable Logic Controller) + Touch Screen ( manual+ auto+ semi-auto operation models)
PUMP SYSTEMRotary Vane Pump: SV300B - 1 set (Leybold)
Roots Pump: WAU1001- 1 set (Leybold)
Holding Pump: D60C- 1 set (Leybold)
Magnetic Suspension Molecular Pump - 1 set (Leybold)
GAS MASS FLOW CONTROLLER 4 channels, Made in China, Seven Star (CS series, ) digital model
VACUUM GAUGE Model: ZDF-X-LE, Made in China: ZDF-X-LE 
LINEAR ION SOURCE1 piece Pre-treating, plasma cleaning + assisted deposition 
SAFETY SYSTEM Numerous safety interlocks to protect operators and equipment 
HEATING Heaters: 30KW. Max. temp.: 450℃
COOLING Industrial Chiller (Cold Water)
POWER MAX. 100KW (Approx.)
AVERAGE POWER CONSUMPTION 45 KW (Approx.)
GROSS WEIGHT T (Approx.)
FOOT PRINT ( L*W*H) 4000*4000 *3200 MM
POWER ELECTRICAL AC 380V/3 phases/50HZ / 5 lines

 

 

High target utilization planar sputtering deposition:  please CLICK HERE to watch the video 
 

   

 

 

Linear Ion Source Plasma Cleaning and Assisted Deposition: please CLICK HERE to watch video

 

 

 

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

 


 

 

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