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Vacuum Flask Copper Plating Equipment, Copper Sputtering Deposition System, TiN and TiC Vacuum Plating
The thick copper film is for thermal isulation between inner and outer bottles. In the surface with PVD vacuum coating technology to generate various colors: black, rainbow, gold, copper, brown etc.
Sputter Deposition
Sputtering is a metal deposition process where the target material is not vaporized using heat, but its metal atoms are physically dislodged from the target by the collision of a bombarding particle. The distance from the target to the part in a sputtering chamber is much shorter than in vacuum deposition. Sputtering is also done under much higher vacuum. The sputtering source itself can be made of elements, alloys, mixtures, or compounds. This form of metal deposition is commonly used in semiconductor manufacturing, on architectural glass, reflective coatings, compact discs CDs, and decorative coatings.
Arc Vapor Deposition
Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films. The arc evaporation process begins with the striking of a high current, low voltage arc on the surface of a cathode ( known as the target) that gives rise to a small (usually a few micrometers wide), highly energetic emitting area known as a cathode spot. The localized temperature at the cathode spot is extremely high ( around 15000℃), which results in a high evlocity (10km/sec) jet of vaporized cathode material, leaving a crater behind on the cathode surface.
Royal technology designed and fabricated the RTAC-SP series PVD vacuum metallizing equipment are
popular used for metal alloys, brass, Zamak ( Zinc alloy) , plastic, electronics, piping and plumbings, plumber fittings, watering system valves and caps; medical and industrial valves etc. The process purpose is mainly to replace the Chromium Electroplating which is hazardous for human and environment.
The High Vacuum Metallizing System Configurations and Features:
| Model | RTAC1008-SPMF | RTAC1250-SPMF | RTAC1615-SPMF |
| Effective Chamber Size | Φ1000 x H800mm | Φ1250 x H1250mm | Φ1600 x H1500mm |
| Deposition Sources | Cylinder Arc (steered circular arc for option) +MF Sputtering Cathode + Linear Ion Source | ||
Vacuum Pumping System ( Leybold Pumps + Turbo Molecular Pump)
| SV300B - 1 set (300m³/hr) | SV300B - 1 set (300m³/hr) | SV300B - 2 set (300m³/hr) |
WAU1001-1set (1000m³/hr) | WAU1001-1set (1000m³/hr) | WAU2001-1set (1000m³/hr) | |
| D60T- 1 set (60m³/hr) | D60T- 1 set (60m³/hr) | D60T- 1 set (60m³/hr) | |
Turbo Molecular Pumps: 2 sets (3500L/S) | Turbo Molecular Pumps: 2 sets (3500L/S) | Turbo Molecular Pumps: 3 sets (3500L/S) | |
| Sputtering Power Supply | 1*24KW (MF) | 2*36KW(MF) | 3*36KW(MF) |
| Arc Power Supply | 6*5KW | 7*5KW | 8*5KW |
| Bias Power Supply | 1*24KW | 1*36KW | 1*36KW |
| Planetary Rods | 6/8 | 12/16 | 20 |
| Heaters | 6*2.5KW | 8*2.5KW | 9*2.5KW |
| Ultimate Vacuum | 9.0*10-4Pa (empty, clean,room temperature) | 9.0*10-4Pa (empty, clean,room temperature) | 9.0*10-4Pa (empty, clean,room temperature) |
| Cycle Time (depends on pump) | 40’~50’ depends on substrate material and coating recipes | ||
| Working Power Requirement | 3Phase 4 lines,AC380V,50HZ,35KW | 3Phase 4 lines,AC380V,50HZ,120KW | 3Phase 4 lines,AC380V,50HZ,150KW |
| Cooling Water | YES, industrial water chiller | ||
| Processing Gas (99.99%) | 4 ways | 4 ways | 4 ways |
| Footprint (mm) | 2000*2000*2300 | 4000*4500*3200 | 5500*5000*3600 |
| Total Weight(KGS) | 4500 | 7000 | 9000 |
| Total Power Consumption(Approx.) | 50KW | 110KW | 170KW |
| Actual Power Consumption(Approx.) | 30KW | 60KW | 80KW |
Above technical parameters only for reference, Royaltec reserves the right for final production based on specified applications.
Please consult us with your expected solutions you want to get from Royaltec, we provide the turn-key coating solutions on this application.
