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H1313NL 10 / 100 Telecom Transformer Magnetic MDL SIN 100D SM TU 16 Pins

LINK-PP INT'L TECHNOLOGY CO., LIMITED

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Address: NO54 South Jinhu Road ChenJiang Town Zhongkai DISTRICT Huizhou 516229 CHINA

Contact name:LINK-PP Global

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H1313NL 10 / 100 Telecom Transformer Magnetic MDL SIN 100D SM TU 16 Pins

Country/Region china
City & Province huizhou guangdong
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Product Details

H1313NL 10/100 Transformer Audio & Signal Telecom Magnetic For Network Protection

 

H1313NL 10/100 Transformer Telecom Magnetic MDL SIN 100D 1:1 SM TU 16pins
Specifications-1H1313NL
StatusActive
Specifications-2H1313NLT
Specifications-3H1313FNL / H1313FNLT
Equivalent CrossLP11XXANL
Transformer TypeDATACOM TRANSFORMER
ApplicationGENERAL PURPOSE
Isolation Voltage1500.0 V
Manufacturer SeriesH1313NL
Mounting FeatureSURFACE MOUNT
Number of Functions2
Operating Temperature-Min0.0 Cel
Operating Temperature-Max70.0 Cel
Physical DimensionD12.7XH7.116 (mm)
Primary Inductance350.0 µH
Turns Ratio (Np:Ns)1:1; 1:1
Diameter12.7 mm
Height7.116 mm

 

Business partner

 

LINK-PP Is The Preferred Designer and Manufacturer of Intel, Intel MinnowBoard MAX Supported by LINK-PP Magnetic RJ45 PN#LPJG16314A4NL.

For any further information,Welcome to visit www.intel.com, you will find out our logo"LINK-PP" on MinnowBoard MAX .

 

XFVOIP5QS-CTRR1-2L POE RJ45 Connector LPJK4010B69NL 10 / 100Base-TX Single Port

 

Applications For Terminal User
Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
 
Competitive Advantage
RJP-003TC1
18 years production experience,
2600 staff,
100% test
Flexible delivery time

 

Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
 
EMS Application
 
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly

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