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50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards
This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.
AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.
Typical property of AD1000
| Property | Units | Value | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | - | IPC TM-650 2.5.5.3 | |
| @ 10 GHz | - | 10.2 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @ 1 MHz | - | IPC TM-650 2.5.5.3 | |
| @ 10 GHz | - | 0.0023 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | - | ||
| TCεr @ 10 GHz (-40-150°C) | ppm/℃ | -380 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.40x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 5.36x107 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 1.80x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 3.16x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 622 (24.5) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | >45 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >180 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | ℃ | >500 | IPC TM-650 2.4.24.6 |
| 5% | ℃ | >500 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/℃ | 8, 10 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/℃ | 20 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | IPC TM-650 2.4.24 | |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | >12 (2.1) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150º) | lb/in (N/mm) | 13.6 (2.4) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | IPC TM-650 2.4.8 | |
| Young’s Modulus | kpsi (GPa) | 200 (1.38) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.9/7.5 (68/52) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.1/4.3 (35/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (GPa) | >425 (>2.93) | ASTM D-3410 |
| Poisson’s Ratio | - | 0.16 | ASTM D-3039 |
| 4. Physical Properties | |||
| Water Absorption | % | 0.03 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 3.20 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.81 | ASTM E1461 |
| Flammability | class | Meets V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | % | NASA SP-R-0022A | |
| Total Mass Loss | % | 0.01 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.00 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.00 | NASA SP-R-0022A |
