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Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Bicheng Electronics Technology Co., Ltd

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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Contact name:Ivy Deng

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Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Country/Region china
City & Province shenzhen guangdong
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Product Details

 

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

 

 

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

 

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material:High performance modified epoxy FR-4 resin
Designation:TU-872 SLK Sp
Dielectric constant:< 3.5
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

 

Typical Properties (TU-872 SLK Sp)

 Typical ValuesConditioningIPC-4101 /126
Thermal   
Tg (DMA)220°C  
Tg (DSC)200°C > 170°C
Tg (TMA)190°CE-2/105 
Td (TGA)340°C > 340°C
CTE x-axis12~15 ppm/°C N/A
CTE y-axis12~15 ppm/°CE-2/105N/A
CTE z-axis2.30% < 3.0%
Thermal Stress,Solder Float, 288°C> 60 secA> 10 sec
T26060 min > 30 min
T28820 minE-2/105> 15 min
T3005 min > 2 min
Flammability94V-0E-24/12594V-0
DK & DF   
Permittivity (RC 50%) @10GHz3.5  
Loss Tangent (RC 50%) @10GHz0.008  
Electrical   
Permittivity (RC50%)   
1GHz (SPC method/4291B)3.6/3.4 < 5.2
5GHz (SPC method)3.5E-2/105-
10GHz (SPC method)3.5 -
Loss Tangent (RC50%)   
1GHz (SPC method/4291B)0.006/0.004  
5GHz (SPC method)0.007E-2/105< 0.035
10GHz (SPC method)0.008  
Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
Electric Strength> 40 KV/mmA> 30 kV/mm
Dielectric Breakdown> 50 kVAN/A
Mechanical   
Young’s Modulus   
Warp Direction26 GPaAN/A
Fill Direction24 GPa  
Flexural Strength   
Lengthwise> 60,000 psiA> 60,000 psi
Crosswise> 50,000 psiA> 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil4~7 lb/inA> 4 lb/in
Water Absorption0.13%E-1/105+D-24/23< 0.5 %

 

 

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