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High Conductive Aluminum PCB 3W / MK High Thermal Conductivity
MCPCB for RGB Lighting
(PCB’s are custom-made products, the picture and parameters shown
are just for reference)
General description
This is a type of aluminum PCB for the application of Led Lighting.
It's a single layer MCPCB board at 1.6 mm thick with 3 W/MK thermal
conductivity. The aluminum plate is from ITEQ, Solder mask and
silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using
supplied Gerber data. 25 boards are packed for shipment.
Parameter and data sheet
| PCB SIZE | 80 x 50mm=1PCS |
| BOARD TYPE | IMS PCB |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz) |
| 3W/MK dielectric material 100um | |
| Aluminum base 5052 | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11mil/11.5mil |
| Minimum / Maximum Holes: | 8.5mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 4 |
| Thermal resistance(°C/W) | ≤0.45 |
| Breakdown Voltage(VDC) | 4000 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Thermal conductivity | 3W / MK dielectric material, MCPCB |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top. 12µm Minimum. |
| Solder Mask Color: | Black |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | no silkscreen |
| Colour of Component Legend | no silkscreen |
| Manufacturer Name or Logo: | as per requirement |
| VIA | no via |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Features and benefits
Effective heat dissipation reduces the operating temperature of the
module and prolongs the service life.
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including
thermal interface materials),
Reduce the volume of the product,
thermal stress test, reliability test, insulation resistance test
and ionic contamination test,
Focus on low to medium volume production
Small quantity order is accepted
Applications
Home Lighting
Light conversion system
Solid relay
Wall lamp
