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4 Layer Hybrid PCB Board Build On 4mil Rogers RO4350B and High Tg FR-4 for 4G Signal Booster
(PCB’s are custom-made products, the picture and parameters shown
are just for reference)
Hi Everyone,
Today, we're going to talk about a type of 4-layer high frequency PCB made on 4mil RO4350B pressed with FR-4.
The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.
Let's take a look at first build-up,
The first layer to the second layer and the third layer to the fourth layer are the Rogers core 4mil (0.102mm) RO4350B, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the dielectric material in the middle is FR-4 epoxy glass, which bonds both cores on top and bottom side. Inner layer is 0.5 ounces and the outer layer is 1 ounce.
The detailed specifications of this board are as follows:
Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm
Layer count: 4 layers
Panel: 55mm x 132mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 um/ Inner layer 18 um
Solder mask / Legend: green / white
Final PCB height: 1.0 mm
Special technology: via in pad (hole filled) under BGA
Standard: IPC 6012 Class 2
Packing: 25 panels are packed for shipment.
Lead time: 12 working days
Shelf life: 6 months
The applications of RO4350B hybrid PCB are wide, such as
(1) preamplifier
(2) radar sensors
(3)digital transmitter and splitter module
(4) GPS antenna
(5) communications relays
(6)analogue transmitter and 4G antennas
(7)RF transmitter, WiFi amplifier, RFID and attenuator etc.
The advantages of RO4350B hybrid PCBs:
1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;
2) Signal integrity performance improved over the stack-ups with all FR4 board;
3) Cost reduced over stack-ups with all low loss material;
4) Reduce signal loss at high frequencies as well;
5) Benefit from our strong capabilities: meeting your PCB demands from prototype mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.
That’s all of today. Thank you for your reading. You’re welcome to
contact us for your RF PCB enquiries.
Appendix: Our PCB Capability 2021
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
