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6 Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 for Satellite Antenna
Today we’re introducing a type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.
Viewing from the stack-up, the 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board. The rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.
The detailed specifications are as follows.
Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4
Dielectric constant: 3.38+/-0.05
Layer count: 6 layers
Via type: Through holes
Format: 105mm x 80mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm / Inner layer 18μm
Solder mask / Legend: Green / White
Final PCB height: 1.4 mm
Others: Impedance controlled PCB
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid 5880 + RO4350B
RT/duroid 5880 + FR4
| PCB Capability | |
| PCB Type: | Hybrid PCB, Mixed PCB |
| Mixed type: | RO4350B + FR4; |
| RO4003C + FR4; | |
| F4B + FR4; | |
| Duroid/RT5880 + RO4350B | |
| Duroid/RT5880 + FR4 | |
| Solder mask: | Green, Red, Blue, Black, Yellow |
| Layer count: | 4 Layer, 6 Layer, Multilayer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 1.0-5.0mm |
| PCB size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP |
