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Taconic High Frequency PCB With TLY-3FF Coating Immersion Gold

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Taconic High Frequency PCB With TLY-3FF Coating Immersion Gold

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

 

Taconic TLY High Frequency PCB with TLY-5, TLY-5-L, TLY-3, TLY-3FF Coating with HASL, Immersion Gold, OSP and Tin

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today, we're talking about high frequency PCB built on TLY material.

 

TLY laminates are manufactured with very lightweight woven fiberglass, which are from Taconic Company. They are more dimensionally stable than chopped fiber reinforced PTFE composites. Since they are more mechanically stable, it is suitable for high volume manufacturing.

 

The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
 

 

We benefit from its following advantages:

1. Dimensionally stable:

High volume fabrication becomes possible.

 

2. Lowest DF

In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz.

 

3. Low moisture absorption

It can work in severe environment.

 

4. High copper peel strength

It’s high up to 2.32, dimensionally stable.

 

5. Uniform and consistent DK

For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of +/-0.02
 

 

Typical applications include:

Cellular communications

Power amplifiers, Filters, couplers

Aerospace, avionics

Phased array antennas

 

There’re 6 members in TLY family. We have stock for TLY-5. Others are purchased according to clients’ requirement.

PCB Capability
PCB Material:Lightweight Woven Fiberglass
TLY Family (Dielectric constant ±0.02)TLY-5A (DK=2.17)
TLY-5A-L (DK=2.17)
TLY-5 (DK=2.20)
TLY-5-L (DK=2.20)
TLY-3 (DK=2.33)
TLY-3FF (DK=2.33)
Layer count:1 Layer, 2 Layer, 4 Layer.
Copper weight:0.5oz, 1oz, 2oz
PCB thickness:0.2mm, 0.3mm, 0.6mm,
0.8mm, 1.6mm
PCB Size:≤400mm X 500mm
Surface finish:Bare copper, HASL, ENIG, Immersion tin etc.
  

 

Bicheng specializes in providing you with prototype, small batches and mass production service.

If you have any questions, please feel free to contact us.

Thank you for your reading.

 

Appendix: Typical Values of TLY

TLY TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK at 10 GHzIPC-650 2.5.5.5 2.2 2.2
Df at 10 GHzIPC-650 2.5.5.5 0.0009 0.0009
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Dielectric StrengthASTM D 149V/mil2,693V/mil106,023
Volume ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms/cm1010Mohms/cm1010
Volume ResistivityIPC-650 2.5.17.1(after humidity)Mohms/cm1010Mohms/cm109
Surface ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms108Mohms108
Surface ResistivityIPC-650 2.5.17.1(after humidity)Mohms108Mohms108
Flex Strength(MD)IPC-650 2.4.4psi14,057N/mm296.91
Flex Strength(CD)IPC-650 2.4.4psi12,955N/mm289.32
Peel Stength(½ oz.ed copper)IPC-650 2.4.8Ibs./inch11N/mm1.96
Peel Stength(1 oz.CL1 copper)IPC-650 2.4.8Ibs./inch16N/mm2.86
Peel Stength(1 oz..CV1 copper)IPC-650 2.4.8Ibs./inch17N/mm3.04
Peel StengthIPC-650 2.4.8(after elevated temp.)Ibs./inch13N/mm2.32
Young's Modulus(MD)ASTM D 3039/IPC-650 2.4.19psi1.4 x 106N/mm29.65 x 103
Poisson's Ratio(MD)ASTM D 3039/IPC-650 2.4.19 0.21 0.21
Thermal ConductivityASTM F 433W/M*K0.22W/M*K0.22
Dimensional Stability(MD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.038 -0.038
Dimensional Stability(CD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.031 -0.031
Density(Specific Gravity)ASTM D 792g/cm32.19g/cm32.19
CTE(X axis)(25-260℃)ASTM D 3386(TMA)ppm/℃26ppm/℃26
CTE(Y axis)(25-260℃)ASTM D 3386(TMA)ppm/℃15ppm/℃15
CTE(Z axis)(25-260℃)ASTM D 3386(TMA)ppm/℃217ppm/℃217
NASA Outgassing(% TML)  0.01 0.01
NASA Outgassing(% CVCM)  0.01 0.01
NASA Outgassing(% WVR)  0.00 0.00
UL-94 Flammability RatingUL-94 V-0 V-0

 

 

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