60mil TMM10i RF Circuit Boards Immersion Silver PTFE Microwave PCB

Today, we will discuss Rogers TMM10i PCB, which is an isotropic thermoset microwave material ideal for applications requiring high plated thru-hole reliability strip-line and micro-strip.

The TMM10i thermoset microwave materials are composed of ceramics, hydrocarbons, and thermoset polymers. They offer a unique combination of electrical and mechanical properties, drawing from the advantages of both ceramic and traditional PTFE microwave circuit laminates.

TMM10i laminates have an exceptionally low TCDk value. This material's isotropic CTE closely matches that of copper, enabling the production of high-reliability plated through holes and achieving low etch shrinkage values. Additionally, its thermal conductivity is approximately double that of traditional PTFE/ceramic laminates, facilitating effective heat removal.

Now, let's delve into the data sheet of TMM10i and explore its properties in more detail.

TMM10i Typical Properties:

Starting with the electrical properties, TMM10i has a process dielectric constant of 9.80±0.245 in the Z-direction at 10 GHz (measured using IPC-TM-650 2.5.5.5). Its design dielectric constant is slightly higher at 9.9 across a frequency range of 8 GHz to 40 GHz (measured using the Differential Phase Length Method). Furthermore, its dissipation factor in the Z-direction at 10 GHz is impressively low at 0.002 (measured using IPC-TM-650 2.5.5.5).

TMM10i exhibits a low thermal coefficient of dielectric constant (TCDk) of -43 ppm/°K over a temperature range of -55℃ to 125℃ (measured using IPC-TM-650 2.5.5.5), making it suitable for applications requiring thermal stability. It boasts insulation resistance greater than 2000 Gohm (measured using ASTM D257), high volume resistivity of 2 x 10^8 Mohm.cm, and a surface resistivity of 4 x 10^7 Mohm (both measured using ASTM D257). Moreover, it demonstrates a dielectric strength of 267 V/mil in the Z-direction (measured using IPC-TM-650 method 2.5.6.2), indicating its resistance to electrical breakdown.

Regarding thermal properties, TMM10i has a decomposition temperature of 425℃ (measured using TGA ASTM D3850), making it suitable for high-temperature applications. It exhibits a coefficient of thermal expansion of 19 ppm/K in the X and Y directions and 20 ppm/K in the Z direction over a temperature range of 0 to 140℃ (measured using ASTM E 831 IPC-TM-650, 2.4.41), which closely matches the isotropic thermal properties of copper. The thermal conductivity of TMM10i is 0.76 W/m/K in the Z-direction at 80℃ (measured using ASTM C518), indicating its ability to dissipate heat and facilitate heat removal.

TMM10i also possesses impressive mechanical properties. It has a copper peel strength of 5.0 (0.9) lb/inch (N/mm) in the X and Y directions after thermal stress from solder float (measured using IPC-TM-650 Method 2.4.8) and a flexural modulus of 1.8 Mpsi in the X and Y directions (measured using ASTM D790). Additionally, it exhibits a moisture absorption rate of 0.16% for a thickness of 1.27mm (0.050") and 0.13% for a thickness of 3.18mm (0.125") (measured using ASTM D570), a specific gravity of 2.77 (measured using ASTM D792), and a specific heat capacity of 0.72 J/g/K. It is also compatible with lead-free processes.

Now let's explore the PCB capabilities we offer for TMM10i. We provide double-layer boards, multi-layer boards, and hybrid types to meet various needs. Our PCBs come in different copper weights, including 1oz (35µm) and 2oz (70µm). We offer a range of thicknesses from 15mil (0.381mm) to 500mil (12.70mm), and the maximum PCB size we offer is 400mm X 500mm, providing ample space for most circuit designs. Additionally, we offer various solder mask colors such as green, black, blue, yellow, red, and purple, allowing flexibility in design choices. Lastly, we provide multiple surface finishes, including immersion gold, HASL, immersion tin, immersion silver, OSP, pure gold plated, ENEPIG, andbare copper, among others.

TMM10i finds versatile applications in RF and microwave circuitry, power amplifiers, filters and couplers, satellite communication systems, global positioning systems antennas, patch antennas, dielectric polarizers, chip testers, and more.

In conclusion, TMM10i materials are known for their temperature stability, thanks to their hydrocarbon matrix filled with ceramic particles. These ceramic fillers contribute to TMM10i's low thermal expansion. However, when drilling TMM10i materials, precautions are necessary due to the abrasive nature of the ceramic filler. It is recommended to avoid high tool surface speeds over 500 SFM and low chip loads under 0.002" per revolution to prevent excessive heat and tool wear.

If you're interested in machining TMM10i laminates, you'll be pleased to know that they can be routed using conventional carbide tools. By selecting the right routing conditions and tools, you can achieve a useful tool life of over 250 linear inches.

Thanks for your reading and see you next time.