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Today, we are exciting to update the introduction of RO4725JXR antenna grade PCB, which offers a reliable and efficient alternative to traditional PTFE-based laminates commonly used in antenna design.
RO4725JXR antenna grade laminates possess exceptional mechanical and electrical properties, allowing antenna designers to achieve significant gain values while minimizing signal loss. These materials are compatible with standard epoxy and high-temperature lead-free solder processing. They also eliminate the need for special treatment during plated through hole preparation, and lamination can be accomplished using the RO4400 bondply series at a temperature of 175°C.
Here are some key details from the data sheet:
RO4725JXR has a process dielectric constant of 2.55 ± 0.05 in the Z direction at 10 GHz and 23°C, as measured by the IPC-TM-650, 2.5.5.5 test method. Its design dielectric constant is 2.64 in the Z direction at frequencies ranging from 1.7 GHz to 5 GHz, measured by the differential phase length method.
The material exhibits a dissipation factor of 0.0026 in the Z direction at 10 GHz and 23°C, according to the IPC-TM-650, 2.5.5.5 test method. At 2.5 GHz, the dissipation factor is 0.0022.
Its thermal coefficient of dielectric constant is +34 ppm/°C in the Z direction across a temperature range of -50°C to 150°C, as measured by the IPC-TM-650, 2.5.5.5 test method.
The volume resistivity is 2.16 X 10^8 MΩ•cm, and the surface resistivity is 4.8 X 10^7 MΩ, both measured under COND A using the IPC-TM-650, 2.5.17.1 test method.
The material demonstrates a remarkably low PIM (Passive Intermodulation) value of -166 dBc at 50 ohm on 0.060" thick material, with a power level of 43 dBm at 1900MHz.
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr Design | 2.64 | Z | 1.7 GHz - 5 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| 0.0022 | 2.5GHz | ||||
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
| PIM | -166 | dBc | 50 ohm 0.060” | 43dBm 1900MHz | |
| Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
| Flexural Strength MD | 121 (17.5) | MPa (kpsi) | RT | ASTM D790 | |
| CMD | 92 (13.3) | ||||
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch +E2/150°C | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y | ||||
| 25.6 | Z | ||||
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
| Td | 439 | °C | ASTM D3850 | ||
| Density | 1.27 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
| Lead-Free Process Compatible | YES |
It has an electrical strength of 630 V/mil at 0.030", as measured by the IPC-TM-650, 2.5.6.2 test method.
The flexural strength is 121 MPa in the MD (Machine Direction) and 92 MPa in the CMD (Cross-Machine Direction), determined by the ASTM D790 test method at room temperature.
RO4725JXR exhibits dimensional stability of less than 0.4 mm/m in the X and Y directions after etching, under the E2/150°C condition, as measured by the IPC-TM-650, 2.4.39A test method.
Its coefficient of thermal expansion is 13.9 ppm/°C in the X direction, 19.0 ppm/°C in the Y direction, and 25.6 ppm/°C in the Z direction across a temperature range of -55°C to 288°C, according to the IPC-TM-650, 2.1.24 test method.
The thermal conductivity of RO4725JXR is 0.38 W/mK° at 50°C, as measured by the ASTM D5470 test method.
Its moisture absorption is 0.24% at 48 hours and 50ºC, measured by the IPC-TM-650 2.6.2.1 and ASTM D570 test methods.
The material has a Tg (glass transition temperature) value greater than 280°C, measured by the IPC-TM-650 2.4.24 test method, and a Td (decomposition temperature) value of 439°C, measured by the ASTM D3850 test method.
Its density is 1.27 gm/cm3, as measured by the ASTM D792 test method.
The copper peel strength is 8.5 pli for 1 oz LoPro ED copper, according to the IPC-TM-650 2.4.8 test method.
RO4725JXR is also compatible with lead-free processes.
| PCB Material: | Hydrocarbon / Ceramic / Woven Glass |
| Designation: | RO4725JXR |
| Dielectric constant: | 2.55 (10 GHz) |
| Dissipation factor | 0.0026 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
In conclusion, the introduction of RO4725JXR antenna grade PCB offers antenna designers a reliable and efficient alternative to traditional PTFE-based laminates. This material provides exceptional mechanical and electrical properties while minimizing signal loss. Its low PIM performance, reaching levels even better than -164dBc, ensures high-quality voice, data, and video communications in antenna systems.
By choosing RO4725JXR as the PCB material for base station antennas and other passive components like couplers and filters, designers can achieve low PIM levels without compromising electrical and mechanical performance. The selection of the right PCB material is crucial in determining the final achievable PIM, and RO4725JXR proves to be a superior option in this regard.
