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[China]
Trade Verify
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
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Verified Suppliers
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We are delighted to introduce our new 2-layer rigid PCB, which has been designed with RO3003 ceramic-filled PTFE composites for exceptional performance. With a lead-free process, this PCB can operate in a temperature range of -40℃ to +85℃, making it suitable for a wide range of applications.
The PCB stackup consists of finished copper 35um, RO3003 dielectric 20 mil (0.508mm), and finished copper 35um. The board dimensions are 117mm x 50mm, with a tolerance of +/- 0.15mm. The minimum trace/space on the PCB is 8/8 mils, and the minimum hole size is 0.4mm. There are no blind or buried vias, and the finished board thickness is 1.6mm. The finished copper weight is 1 oz (1.4 mils) on all layers, with a via plating thickness of 1 mil. The surface finish is immersion tin, and there is no silkscreen on either the top or bottom of the board.
The new PCB features 77 components, 123 total pads, and 100 vias. It has 71 thru-hole pads and 52 top SMT pads, with no bottom SMT pads. The PCB has 8 nets and has been tested with 100% electrical testing to ensure its reliability.
The type of artwork supplied for this PCB is Gerber RS-274-X, and it meets the IPC-Class-2 standard. Our customers worldwide can benefit from this high-quality PCB that has been designed with RO3003 ceramic-filled PTFE composites and a lead-free process, making it suitable for a variety of applications.
In conclusion, our new 2-layer rigid PCB with RO3003 ceramic-filled PTFE composites is a high-performance solution with exceptional reliability. Its wide temperature range and lead-free process make it an excellent choice for various applications. We are proud to offer this top-of-the-line PCB to our customers worldwide.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes |
RO3003 Ceramic-Filled PTFE Composites: A Comprehensive Guide to
High-Performance PCBs
The evolution of electronics has ushered in a new era of high-frequency and high-temperature requirements for PCBs. To meet this demand, RO3003 ceramic-filled PTFE composites have emerged as a leading material, offering exceptional performance and reliability across a range of applications.
Introduction to RO3003 Ceramic-Filled PTFE Composites
RO3003 is a composite material made up of PTFE and ceramic powder.
It provides superior electrical, thermal, and mechanical
properties, making it an ideal material for high-frequency and
high-temperature applications.
Advantages of RO3003
RO3003 offers numerous advantages over traditional PCB materials,
including lower dielectric loss, improved signal integrity, and
superior thermal management. Additionally, its high thermal
coefficient of ε makes it an efficient heat dissipater, perfect for
high-power applications.
Electrical Properties of RO3003
RO3003 has a stable dielectric constant of 3.0±0.04 across a wide
range of frequencies. It also has low dissipation factor, allowing
for minimal loss during signal transmission. Furthermore, RO3003
boasts high volume and surface resistivity, making it a top choice
for high-frequency applications.
Thermal and Mechanical Properties of RO3003
RO3003 has a low coefficient of thermal expansion, enabling it to
undergo thermal cycling without delamination or cracking. Its high
tensile modulus gives it enhanced strength and durability, while
its excellent dimensional stability ensures it can maintain its
shape and size even in extreme temperatures.
Applications of RO3003
RO3003 is ideal for a range of applications, including cellular
base stations, aerospace and defense, high-speed digital circuits,
power amplifiers, antennas, and filters.
RO3003 vs. Other PCB Materials
Compared to other PCB materials, RO3003 offers superior performance
in high-frequency and high-temperature applications. Its lower
dielectric loss results in less signal attenuation.
Testing and Certification of RO3003 PCBs
RO3003 PCBs undergo rigorous testing and certification to ensure
their reliability and performance. They are tested for electrical,
thermal, and mechanical properties, as well as compatibility with
lead-free processes.
In conclusion, RO3003 ceramic-filled PTFE composites provide exceptional performance and reliability for high-frequency and high-temperature applications. Their superior electrical, thermal, and mechanical properties make them an ideal material for a wide range of applications. With continued development and testing, RO3003 is poised to remain a leading choice in the world of high-performance PCBs.
