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Customized FR4 PCB Design and Layout Industrial PCB Assembly X-Ray Inspection For Industrial Equipment

Shenzhen Sky-Win Technology Co., Ltd

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[China] country

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Address: 4F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China

Contact name:Luna Xie

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Shenzhen Sky-Win Technology Co., Ltd

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Customized FR4 PCB Design and Layout Industrial PCB Assembly X-Ray Inspection For Industrial Equipment

Country/Region china
City & Province shenzhen
Categories Other Electronic Components
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Product Details

Customized FR4 PCB Design and Layout Industrial PCB Assembly X-Ray Inspection For Industrial Equipment

 

 

Industrial PCB Assembly Services

 

Industrial PCB Component Sourcing
We undertake sourcing of original components. Given our extensive track record of dealing with component suppliers, our sourcing is easier, faster and helps you save on costs.

Industrial PCB Prototyping
With our engineering abilities and expertise to design Industrial PCB prototypes, you can be sure of avoiding costly mistakes. Bank upon us to create custom industrial prototypes basis your exact needs with quick turnaround times.

Industrial PCB Re-work
If you have had an industrial PCB that has been in use for several years and needs revision, you can count on our services. Not only we can help you with obsolete component sourcing but also reverse engineering your old Industrial PCBs

 

Sky-Win PCB specializes in prototype and low volume PCB assembly,

 

SMT, Through Hole and Mixed Assembly
Passive Down to 01005 Sizes
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (uBGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP)
Small Chip Packages (Pitch of 0.2 mm)

 

To get a full quotation of the Industrial PCB Assembly

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)

 

Industrial PCB Assembly Process Capability

 

SMTPosition accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-SolderMax. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-SolderMetal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fitPress range:0-50KN
Max. PCB size:800X600mm
TestingICT,Probe flying,burn-in,function test,temperature cycling

 

 

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