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4 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly

Shenzhen Sky-Win Technology Co., Ltd

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Address: 4F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China

Contact name:Luna Xie

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4 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly

Country/Region china
City & Province shenzhen
Categories Electronics Production Machinery
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Product Details

4 Layers SMT PCB Assembly PCBA Prototype Internet Of Things Black Soldmask With Board Thickness 1.0mm

 

 

Description of process for SMT PCB Assembly


SMT PCB assembly procedures usually include solder paste printing, chip installation, reflow soldering, AOl, X-ray and rework. A visual inspection is performed after each step of the program.

 

SMT PCB Basic Process Components

 

Silk Screen

Testing

Placement

Reflow soldering,

Cleaning

Testing

Repair

 

SMT PCB Assembly Specification

 

SMT Project name ItemSUB P5 PCBA
Manufacturing processSMT, AOI test,X-RAY irradiation analysis,CNC panel
Material accuracy0402+CO2 sensor
Number of materials43 kinds
Material consumption109  pcs
PCB processImmersion Glod
Number of PCB layers4 layers
PCB SurfaceDouble-Sided Boards
MaterialFR-4
Board thickness1.0 mm
Manufacturing quality systemIATF16949
PCB quality systemROHS/UL
Application FieldAir detector, temperature and humidity meter, Internet of Things

 

SMT PCB Assembly Manufacturer

 

Shenzhen SKY-WIN Technology Co., Ltd  was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.

 

SMT PCB Assembly Inspection Necessity


In order to ensure the quality and performance of the assembled PCB, it is very necessary to check during the entire SMT assembly process. Multiple types of inspections must be used to reveal manufacturing defects, which can reduce the reliability of the final product.


Visual inspection is most commonly used in SMT patch assembly. As a direct inspection method, visual inspection can be used to indicate obvious physical errors, such as component displacement, missing components, or component irregularity.


Visual inspection is not suitable for visual inspection. Tools such as a magnifying glass or microscope can also be used. In order to further point out the defects occurring in the welding ball, AOI and X-ray inspection can be used after the completion of coal bonding

 

SMT PCB Assembly Case

 

 

 

 

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