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High Frequency Printed Circuit Board Assembly For Wireless Communication

Shenzhen Sky-Win Technology Co., Ltd

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Address: 4F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China

Contact name:Luna Xie

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High Frequency Printed Circuit Board Assembly For Wireless Communication

Country/Region china
City & Province shenzhen
Categories Electronic Accessories & Supplies
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Product Details

High Frequency PCB Bule Printed Circuit Board Assembly For Wireless Communication

 

 

Communication PCB board construction characteristics


In the field of communication electronics, communication PCB boards are widely used in wireless networks, transmission networks, and data communications. And fixed-line broadband. Related PCB products include baseboards, high-speed multilayer boards, high-frequency microwave boards and multifunctional metal substrates.
In order to cope with the outbreak of 5G communication, 5G air outlet has set off another wave of PCB, from 1G to 5G, the upgrade of communication technology: The upgrade of a new generation of communication technology has brought revolutionary changes to the terminal products and redefined the terminal products. Products, driven by the entire industrial chain reconstruction and great changes.

 

Communication PCB Assembly Manufacturer


Shenzhen SKY-WIN Technology Co., Ltd, we were founded in 2015, focusing on PCBA, the related SMT, after welding, assembly, testing, program customization, mode of OEM, ODM, other production and sales, which is a comprehensive high-tech enterprise that provides the a one-stop service.We have obtained professional certificates including the “lS09001, IATF16949 Quality Management System Certification”, “the High-tech Enterprise Certification”, we also received praise from many customers, and has been awarded the title of "Excellent Supplier" for many times.

 

Communications PCB Capacity

 

Application fieldCommunication 
Soldmask & SilkscreenGreen & White
Min Line Width/Gap4/4 mil (1mil=0.0254mm)
Board Thickness0.3~4.0mm
MaterialFR-4, Aluminum
Copper Thickness0.5~4oz
PCB Glod processImmerison Gold
PCB layers1~20 layers
Surface TreatmentHASL,ENIG,OSP
Min Hole Size0.2mm (+/- 0.025)
Manufacturing quality systemIATF16949
FeatureHigh reliability and precision

 

Communications PCB Assembly Case

 

 

 

 

 

 

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