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2OZ Copper Double Layer Circuit Board Power Supply Product PCB

Witgain Technology Limited
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Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

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Witgain Technology Limited

2OZ Copper Double Layer Circuit Board Power Supply Product PCB

Country/Region china
City & Province shenzhen
Categories Switching Power Supply
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Product Details

2 OZ Copper Power Supply Product PCB Double Layer Circuit Board

 

 

  • Main Features:

 

1 2 Layer FR4 substrate material printed circuit board.

2 Double layer copper, copper thickness is 70um/70um.

3 Finished pcb thickness is 1.6mm.

4 Used in power supply product..

5 ENIG+Carbon ink surface treatment.

6 2 layer pcb with 7/7mil min line space and width.

7 Green solder mask and white silkscreen.

8  Need customer to send us the gerber file or PCB file

 

 

  • Our Equipment List:

 

NOEquipment NameEquipment BrandEquipment QTY
1Automatic CuttingSCHCLLING-CA68581
2Roll CuttingQIXIAN2
3Vertical CuttingSHANGYUE2
4Innerlayer pretreatmentJIECHI4
5Automatic coat&wiringQUNYU4
6Automatic exposureCHUANBAO11
7Large table exposureHECHUAN2
8Laser PlotterORBOTEC3
9Etching lineKB4
10PE PunchingPE-30001
11AOIORBOTEC10
12Double row brownKB3
13PP CuttingZHENGYE5
14PP ChoppingZHONGDA2
15Hot-melt machineHANSONG6
16Riveting machineJIAOSHI6
17X-Ray CheckHAOSHUO5
18Automatic refluxLANDE2
19Steel plate washerFENGKAI2
20Large size pressDATIAN8热4冷
21X-Ray Drilling targetHAOSHUO8
22Ccd Drilling targetXUELONG10
23Automatic grindingXINHAO5
24Plate thickness MeasuringAISIDA2
25Four axis gongs machineDALIANG2
26Two axis gongs machineBIAOTEFU4
27Automatic grinding millJIEHUI2
28Drilling machineTONGTAI13
29Hole testing machineYAYA1
30Sinking rough millKB1
31Vertical copper wireYAMEI1
32Automatic electroplating lineJINMING1
33Dryer after electroplatingKB1
34Etch machineKB1
35Film checking machineYUBOLIN2
36Line pre-processingKB2
37Automatic laminatorZHISHENG3
38Outer exposure machineCHUANBAO8
39Outer exposure machineHECHUAN3
40Etch machineJULONG1
41Line developing machineKB1
42Sand blasting machineKB1
43Precoarsening pretreatmentKB2
44Electrostatic spraying lineFURNACE1
45Automatic screen printing machineHENGDAYOUCHUANG12
46Pre baked tunnel furnaceKB1
47Solder resist exposure machineCHUANBAO6
48Solder resist exposure machineHECHUAN2
49Post baked tunnel furnaceGC0-77BD2
50Solder resist developing machineKB1
51Screen printing machine1.8mm/2.0mm4
52Character baking tunnel furnaceGC0-77BD1
53Sunk Tin spray line 2
54Nickel palladium and gold wireXINHUAMEI1
55Alternator 2
56OSP lineKB1
57Gongs machineYIHUI20
58V-CUTZHENGZHI1
59CNC V-CUT machineCHENGZHONG2
60Hydraulic punch pressSRT2
61Test machineMASON17
62High speed flying needle testerWEIZHENGTAI3
63Four wire flying needle testerXIELI2
64Product washing machineKB2
65Plate warping machineXINLONGHUI2
66Vacuum packaging machineSHENGYOU4

 

 

  • FQA:

 

Q1: What is Backdrilling in PCB Fabrication?

A1: 

 

 
 

 

Back drilling or Controlled depth drilling is a process used to remove the unwanted portion of a PCB Via Stub. Plated Through Hole (PTH) Vias are used to connect two or more layers of a Printed Circuit Board to each other. However often, a via does not need to run the entire thickness of the board to connect each layer. For example, if we have a 10 layer PCB and need to connect layer 1 to layer 3 using a via, the PTH via runs through all the layers of the PCB even though layers 3 to 10 do not need to be connected to each other using that particular via. This unused portion of the via is called a stub. These stubs can cause significant signal distortion (click here to read more about PCB via Stubs).

Backdrilling is a technique used to remove the unused portion of the stub (conductive plating) in a printed circuit board. This is removed by using a drill that has the diameter slightly larger than the diameter of the original via (PTH) hole. In practice, it is achieved by re-drilling the PTH down to a predetermined stub length of less than 10 mils from the signal layer.

 

 

In case the via is connecting two internal layers only, then it is necessary to remove the top and bottom stub to improve the high-speed signal quality (see figure below). Backdrilling is a cost-effective solution as compared to the lamination technique (used for blind and buried vias) to manage the signal quality in a high-speed signal bath. If properly executed, it will not affect the performance and reliability of the PCB.

 

 

How does the stub length distort the signal quality?

 

When a signal flows down the length of a via, it splits into two parts at the junction between the internal layer and stub. One part travels towards the receiver end through the internal layer, and the other part travels towards the stub end. The stub act as an unterminated transmission line, so the signal reflects back towards the junction. At the junction, the signal again split into two with one signal returning to the source, and the other following the trace. Hence, the source signal is disturbed. The source distortion is the main cause for deterministic jitter (deviation clock pulse edge from its original position). Then the deterministic jitter leads to an increase in Bit error rates (BER), cross talk, EMI/EMC radiation, and the attenuation.

 

 

 

 

 

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