AL2O3 Ceramic PCB Board Thickness 2.3MM 105UM Copper
Main Features:
1 Part NO: CeramicPCB0001
2 Layer Count: 2 Layer PCB
3 Material Kind: AL203 Ceramic
4 Finished Board Thickness: 2.3MM
5 Copper Thickness: 105/105um
6 PCB Size: 120MM*100MM
7 Application Area: RF Power Supply
Our Product Categories:
Our Product Categories |
Material Kinds | Layer Counts | Treatments |
FR4 | Single Layer | HASL Lead Free |
CEM-1 | 2 Layer/Double Layer | OSP |
CEM-3 | 4 Layer | Immersion Gold/ENIG |
Aluminum Substrate | 6 Layer | Hard Gold Plating |
Iron Substrate | 8 Layer | Immersion Silver |
PTFE | 10 Layer | Immersion Tin |
PI Polymide | 12 Layer | Gold fingers |
AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
Halogen free | 18 Layer | HDI Laser drilling |
Copper based | 20 Layer | Selective immersion gold |
| 22 Layer | immersion gold +OSP |
| 24 Layer | Resin filled in vias |
FAQ:
Q1:What is the Thermal Resistance of a PCB?
A1: Thermal Resistance is a property of a printed circuit
board that specifies its resistance to heat dispersion. A low
thermal resistance in a PCB makes the dispersion of heat easier.
This is basically the inverse of thermal conductivity. The thermal
resistance of a PCB can be calculated by evaluating all the layers
of the board and the heat parameters of the material.
To find the total thermal resistance for your board, you must
include all layers of the board and the associated heat parameters
for the type of material through which heat will flow.
[Formula]
R_theta = absolute thermal resistance (K/W) across the thickness of
the sample
Delta x = thickness (m) of the sample (measured on a path parallel
to the heat flow)
k = thermal conductivity (W/(K·m)) of the sample
A = cross-sectional area (m2) perpendicular to the path of heat
flow
In addition to the thermal resistance of the board. The Thermal
resistance of Vias must also be calculated. This usually depends on
the copper trance, the laminate and the substrate and their
respective thermal resistivities.
How can you reduce the Thermal Resistance of a PCB?
- Thermal resistance can be reduced by increasing the thickness of
the copper traces.
- Another method to decrease the thermal resistance is to place
copper pads below the hot components. The high thermal conductivity
of copper provides a low resistance path for the dispersion of
heat. These pads can be connected to an internal ground plane
through vias, which have good thermal conductivity and thus help
move heat away from the component.
- Using Heat Sinks can help lower the thermal resistivity of the
board.