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Controlled Impedance PCB Flexible Printed Circuit Board Assembly

Huaswin Electronics Co.,Limited
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Contact name:Vicky Lee

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Huaswin Electronics Co.,Limited

Controlled Impedance PCB Flexible Printed Circuit Board Assembly

Country/Region china
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Product Details

 

Controlled Impedance PCB Flexible Printed Circuit Board Assembly

 

 

Welcome to Huaswin!

 

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP 

assembly ,IC pre-programming / burning on-line, testing, packing. 

 

 

PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers) 

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 


 

PCB Assembly services: 

 

 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

 


Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering 

Material Sourcing 
IC pre-programming / Burning on-line 

Function testing as requested 

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

 When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 

plastics, casings and print & packaging material

 

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

 

 

ISO Certification:
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!

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