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SPI 6500 3D Solder Paste Thickness Tester Machine Powerful SPC Function

INFINITE AUTOMATION CO ., LIMITED

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Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China

Contact name:Rosy Shao

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SPI 6500 3D Solder Paste Thickness Tester Machine Powerful SPC Function

Country/Region china
City & Province shenzhen
Categories Electronics Production Machinery
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Product Details

Avail of Infinite Automation's perfect solution to your Solder Paste Thickness testing. Here we are introducing our high accuracy Solder Paste Thickness Testing Machine, the INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester. This Solder Paste Thickness Testing Equipment is easy to use. INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester is designed with a user-friendly programming interface. This SPI equipment has multiple measurement methods, adjustable scanning distance, 3D image simulation function, independent 3D dynamic observer, and a powerful SPC function.

 

INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester

 

Product Function:

  • Friendly programming interface.
  • Multiple measurement methods
  • Adjustable scanning distance
  • Image of 3D simulation function
  • Independent 3D dynamic observer
  • Powerful SPC function
  • Once built back to the screen center function
  • Can measure silkscreen and copper thickness

 

Product Features:

  • The original high-definition color camera imported from Germany is used to ensure the high precision and high stability of the test.
  • It adopts a military-grade secondary laser, which is less interfered with by the light source of the external environment, and is more stable, and has a longer life.
  • With flexible hardware design, light source, laser, and camera, PCB boards of different colors can be tested.
  • The software analysis condition is based on the database, and the early warning function is realized according to the analysis condition, which is intuitive and easy to understand.
  • Powerful report analysis function, automatically generates R-Chart, X-Bar, and automatically calculates CPK.
  • Export detailed and complete SPC reports, completely avoiding all the drawbacks of handwritten reports.
  • The software adopts a simple and practical concept, focusing on the high-precision design of the test, and the repetition accuracy of the calibration block reaches positive and negative
  • 0.001mm.

 

Technical Parameters:

 

PARAMETERS
1. Product model: SPI-6500
2. Application range: solder paste. Red glue. BGA. FPC. CSP
3. Measurement items: thickness. Area, volume, 3D shape, plane distance
4. Measurement principle: laser 3-angle function method measurement automatically calculates and displays the PCB deformation or tilt angle
5. Software language: Chinese/English
6. Lighting source: white high-brightness LED
7. Measuring light source: Red laser module Y-axis movement range: 50 mm
8. Measurement method: automatic full-screen measurement. Frame selection automatic measurement. Frame selection manual measurement
9. Field of view: 12mm*15mm
10. Camera pixels: 3 million/field of view
12. The highest resolution: 0.1um
13. Scanning distance: 5 um /10 um /15 um /20 um
14. Repeated measurement accuracy: height is less than plus or minus 1um, area <1%, volume <1% magnification: 50X
15. Maximum measurable height: 5 mm
16. The highest measurement speed: 250Profiles/s
17. 3D mode: 3 different 3D simulation images of surface, line, and point, which can be zoomed and rotated

 

Images:

 

 

INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester image 2

INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester image 3

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