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FPC Laser Depaneling Machine for PCB Board Manufacturing Process with ±20 μm Precision

Dongguan Chuangwei Electronic Equipment Manufactory

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FPC Laser Depaneling Machine for PCB Board Manufacturing Process with ±20 μm Precision

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

FPC Laser Depaneling Machine for PCB Board Manufacturing Process with ±20 μm Precision Parameter:

 

Parameter 

 

 

 

 

 

 

 

Technical parameters

Main body of laser1480mm*1360mm*1412 mm
Weight of machine1500Kg
PowerAC220 V
Laser355 nm
Laser

Optowave 10-20W(US)

Material≤1.2 mm
Precision±20 μm
Positioning±2 μm
Platform±2 μm
Working area450*430 mm
Maximum3 KW
VibratingCTI(US)
PowerAC220 V
Diameter20±5 μm
Ambient20±2 ℃
Ambient<60 %
The MachineMarble

 

FPC Laser Depaneling Machine Features

 

1. Neat and smooth edge, no burr or overflow

2. More quick and easy, shorten the delivery time

3. High quality ,no distortion,surface clean& uniformity;

4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed.

 

FPC Laser Depaneling Machine Advantages

  1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries;
  2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
  3. Reduce energy consumption, Cost savings;
  4. Cost-effective, fast cutting speed, stable performance.

FPC Laser Depaneling Machine Application

 

FPC and some relative materials;

  FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

 

 

 

 

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