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Mustar Electronic PCBA Circuit Board Assembly Multilayer For Remote Control Toy

Shenzhen Yingsheng Technology Co., Ltd.

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Address: Shenzhen YingSheng Technology Co., Ltd 805, Tongxin Technology Building, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen

Contact name:Zhou

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Mustar Electronic PCBA Circuit Board Assembly Multilayer For Remote Control Toy

Country/Region china
City & Province shenzhen
Categories Toy Parts
InquireNow

Product Details

Mustar Electronic Pcb Assembly Manufacturer Multilayer Pcba Manufacturing Battery Pcba Remote Control Toy Pcba

 

Step 1. Once everything is placed in its place, an electric rule check is run to ensure no evident faults.
These may include breaks in wires or connections or any missing connection to ground or power etc. Once the schematic is done, the board layout view is checked.
Step 2. The components are moved to proper places that make good sense.
Step 3. For the board production, signals are assigned to each layer and varying signals on a single layer cannot touch.
Step 4. After the signals are laid, a design rule check needs to run to ensure the proper placement of holes, traces, etc. These rules can be customized as well.
Step 5. If the design is approved, the design files can be uploaded.
The communication language of PCB fabrication is a Gerber file or IPC-2581. Each board has multiple files, one for each layer. Another file known as the "drill file" is used to define where holes need to be drilled.
Step 6. Go to PCBONLINE's online quotation system, choose the second "Assembly option", and click to upload Gerber.
When the Gerber files are uploaded, it will run its own error check procedure. It produces an image file that can be printed and used to check what the final layer will look like. You'll need to enter the PCBA number.

YScircuit HDI PCB manufacturing capabilities overview
Featurecapabilities
Layer Count4-60L
Available HDI PCB Technology1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness0.3mm-6mm
Minimum line Width and Space0.05mm/0.05mm(2mil/2mil)
BGA PITCH0.35mm
Min laser Drilled Size0.075mm(3nil)
Min mechanical Drilled Size0.15mm(6mil)
Aspect Ratio for laser hole0.9:1
Aspect Ratio for through hole16:1
Surface FinishHASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill OptionThe via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration±4mil
Solder MaskGreen, Red, Blue, White, Black, Purple, Matte Black, Matte green.etc.
 


 

YScircuit Bare Boards Normally Delivery Time
layer/m²S<1㎡S<3㎡S<6㎡S<10㎡S<13㎡S<16㎡S<20㎡S<30㎡S<40㎡S<50㎡S<65㎡S<85㎡S<100㎡
1L4wds6wds7wds7wds9wds9wds10wds10wds10wds12wds14wds15wds16wds
2L4wds6wds9wds9wds11wds12wds13wds13wds15wds15wds15wds15wds18wds
4L6wds8wds12wds12wds14wds14wds14wds14wds15wds20wds25wds25wds28wds
6L7wds9wds13wds13wds17wds18wds20wds22wds24wds25wds26wds28wds30wds
8L9wds12wds15wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
10L10wds13wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
12L10wds15wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
14L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
16L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds

 30wds

 


 




 












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