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[China]
Trade Verify
Address: 3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China
Contact name:Sia Li
Chengdu Cesgate Technology Co., Ltd |
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Verified Suppliers
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Printed Circuit Board SMT Prototype Fast Turn Turnkey PCB Assembly IPC Class III
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components Turnkey PCB Assembly technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) Turnkey PCB Assembly With CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Testing and maintenance department
STHL provide custom test service according to client's requirements and products. Usually STHL PCBA Tech
offers a full range of testing service. Including:
*AOI(Automatic Optical Inspection)
* Function Testing
* In Circuit Testing
* Testing Jig
* Testing Service
* X-Ray for BGA Testing
* Printing Solder Paste Test
Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.
Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash
testing and earth bonding tests can also be undertaken where required.
CESGATE Turnkey PCB Assembly welding quality control
1. The SMT line is equipped with high-end equipments,
high-precision and high-yield processing
2. Quality inspection and control are carried out in each
processing link to prevent defective products from flowing into the
next link.
3. Equipped with a number of quality personnel throughout the
sampling inspection.
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
FAQ
| Q: What are the main products of your PCB/PCBA services? CESGATE: Our PCB/PCBA services are mainly for the industries including Medical, Automotive, Energy, Metering/Measurements, Consumer Electronics. |
| Q: Is CESGATE a factory or trade company? CESGATE: CESGATE is a factory with PCB factory located in Senzhen and SMT assembly factories in both Shenzhen and Chengdu. |
| Q: Can we inspect quality during production? CESGATE: Yes, we are open and transparent on each production process with nothing to hide. We welcome customer inspect our production process and check in house. |
| Q: How can we ensure our information should not let third party to
see our design? CESGATE: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level. |
| Q: What does CESGATE need for a customized PCB order? CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products. |
6) High Standard SMT&Solder Assembly Line
5) Nitrogen gas reflow soldering technology for SMT.
7) High density interconnected board placement technology capacity.
