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[China]
Trade Verify
Address: 3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China
Contact name:Sia Li
Chengdu Cesgate Technology Co., Ltd |
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Verified Suppliers
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Automotive Aerospace PCB Assembly Service Process Manufacturer Factory
SMT (Surface Mounted Technology):
Surface mount technology mainly uses the mounter to mount some tiny
parts on the PCB. The production process is: PCB board positioning,
solder paste printing, mounter placement, reflow oven and finished
inspection. With the development of technology, SMT can also mount
some large-size parts, for example, some larger-sized mechanical
parts can be mounted on the motherboard.
SMT integration is very sensitive to positioning and the size of
parts. In addition, the quality of solder paste and printing
quality also play a key role.
DIP:
DIP is "plug-in", which is to insert parts on the PCB board. Due to
the large size of the parts and it is not suitable for placement or
the manufacturer's production process cannot use SMT technology,
the parts are integrated in the form of plug-ins. At present, there
are two implementation methods of manual plug-in and robot plug-in
in the industry. The main production process is: sticking back glue
(to prevent tin from being plated where it should not be), plug-in,
inspection, wave soldering, and brushing (remove the Stains left in
the process) and finished inspection.
Technical Requirement for PCB Assembly service
Professional Surface-mounting and Through-hole soldering technology
High Standard SMT&Solder Assembly Line
ICT(In Circuit Test),FCT(Functional Circuit Test) technology
PCB Assembly service With CE, FCC, Rohs Approval
Nitrogen gas reflow soldering technology for SMT
High density interconnected board placement technology capacity
Various sizes like 1206, 0805, 0603 components SMT technology
Our company currently has 7 wave soldering production lines and 10 post-DIP soldering lines. We can make special fixtures according to customer requirements and product conditions to ensure product reliability and effectively improve plug-in efficiency.
Our DIP post-welding personnel have rich experience, and have formulated detailed standardized operation guidelines and SOP operation instructions to meet the high-quality requirements of high-end customers.
CESGATE SMT assembly welding quality control:
1. The SMT line is equipped with high-end equipments,
high-precision and high-yield processing
2. Quality inspection and control are carried out in each
processing link to prevent defective products from flowing into the
next link.
3. Equipped with a number of quality personnel throughout the
sampling inspection.
Specification
Items | Capabilities | |
1 | Layers | 2-68L |
2 | Maximum machining size | 600mm*1200mm |
3 | Board thickness | 0.2mm-6.5mm |
4 | Copper thickness | 0.5oz-28oz |
5 | Min trace/space | 2.0mil/2.0mil |
6 | Minimum finished aperture | 0. 10mm |
7 | Maximum thickness to diameter ratio | 15:1 |
8 | Via treatment | Via, blind&buried via, via in pad, Copper in via … |
9 | Surface finish/treatment | HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
10 | Base Material | FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350, |
11 | Solder mask color | Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black |
12 | Testing Service | AOI, X-Ray, Flying-Probe, Function Test, First Article Tester |
13 | Profiling Punching | Routing,V-CUT,Beveling |
14 | Bow&twist | ≤0.5% |
15 | HDI type | 1+n+1,2+n+2,3+n+3 |
16 | Min mechanical aperture | 0.1mm |
17 | Min laser aperture | 0.075mm |
FAQ
| Q: What is your delivery date? CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation. Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days. |
| Q: What is the difference between the HDI board and the general
circuit board? CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once. |
| Q: What are the types of solder mask? CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type. |
| Q: What are the common substrates of CESGATE? A:Tg-140: ISOLA FR402 / NAN-YA NP-140 Tg-150: ISOLA IS400 / NAN-YA NP-155 Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F |
