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16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

Quanhong FASTPCB
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Address: Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China

Contact name:Yu

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Quanhong FASTPCB

16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

Country/Region china
City & Province shenzhen guangdong
Categories Plastic Sheets
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Product Details

HDI stands for High Density Interconnector. It is a kind of printed circuit board that uses micro-blind buried hole technology to produce a circuit

High Density Interconnector PCB

board with High circuit distribution Density. HDI is a compact product designed for small volume users.

HDI circuit advantages

1. Reduce PCB cost: When PCB density increases to more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.

2. Increase circuit density: traditional circuit board and parts interconnection

3. It is conducive to the use of advanced construction technology

4. Better electrical performance and signal correctness

5. Better reliability

6. Can improve the thermal properties

7. Can improve rf interference/electromagnetic interference/electrostatic release (RFI/EMI/ESD)

8. Increase design efficiency

 

ItemHDI Advanced Technology
201920202021
Structure5+n+56+n+67+n+7
HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
Board Thickness(mm)Min. 8L0.450.40.35
Min. 10L0.550.450.4
Min. 12L0.650.60.55
MAX. 2.4 
Min. Core Thickness ( um )504040
Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
ItemHDI Advanced Technology
201920202021
Min. Mechanical Drill hole size(um) **200200150
Max. Through Hole Aspect Ratio *8:110:110:1
Min. Laser via/Pad Size ( um )75/20070/17060/150
Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
Laser Via on PTH(VOP)designYesYesYes
Laser X type through hole(DT≤200um)NA60~100um60~100um
Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
outer Layer50 /50/ 2040 /50 /2040 /40 /17
Min BGA Pitch (mm) 0.350.30.3
ItemHDI Advanced Technology
201920202021
Solder mask Registration (um)+/- 30+/- 25+/- 20
Min. Solder Mask Dam (mm)0.070.060.05
PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
< 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
PCB Warpage Control≤0.5%≤0.5%≤0.5%
cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
Laser directly+/- 50+/- 50+/- 50
Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

 

Packaging & Delivery
Packaging Details:Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port:Shenzhen or Hongkong
Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
 Est. Time(days)202125To be negotiated

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

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