Selective Soldering Process Hot Bar Reflow Soldering Machine 0.4MPa

0.4MPa Selective Soldering Process Hot Bar Reflow Soldering Machine

Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated using a heating element (called a thermode or a Hot Bar) to a sufficient temperature to melt the solder.

The parts are then cooled below the solidification temperature to form a permanent electro-mechanical bond.

Hot Bar Reflow Soldering​ Features:

1. According to different products, optional temperature for your choice.

2. Unique material thermode head, ensure the average pressure

3. Has vacuum function, easier for adjustment and positioning.

4. NC temperature, clear and high precision

5. With digital pressure gauge, pressure range can be preset.

6. Microcomputer control, high accuracy and stable.

7. Programmable curve Including pre-heating and reflow soldering temperature.

8. Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.

9. Precise PID control, phase angle replace pulse drive.

10. Less Libration, less noise, avoiding voltage fluctuate

11. Rotable dual fixtures with high working efficiency

12. Touch screen input data, simplify the operation.

13. Real-time display temperature curve and temperature data

Hot Bar Reflow Soldering Specification:

The benefits of Hot Bar Reflow Soldering:

• Fast temperature ramp-up and cool-down
• Closed loop temperature control
• Accurate positioning of the parts
• Multiple connections can be made simultaneously
• Cost effective due to elimination of third component such as connector

Hot Bar Reflow Soldering Application: