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Fr4 Blue Solder Optical PCB Circuit Board For Communication Module 1.6 MM

Shenzhen Lefang Electronics Co., Ltd
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Address: A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway

Contact name:Cyan Hong

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Shenzhen Lefang Electronics Co., Ltd

Fr4 Blue Solder Optical PCB Circuit Board For Communication Module 1.6 MM

Country/Region china
City & Province shenzhen guangdong
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Product Details

 

 

UL Approved Fr4 Blue Solder Optical Communication Module PCB Circuit Board

 

 

The layer count of the PCB Circuit Board is 4 Layers, and it was made with FR - 4 board material, with 1.6 mm board thickness. Also, the board size of this PCB Circuit Board is 135 * 340 mm, with blue solder mask and Immersion Gold surface treatment.

 

 

 

 

 

     How to get quick quotation?

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
 
        Technical Data
 
                              ItemDetails
                 Max layer count20 L
                 Max board thickness6.0 mm
                 Max aspect ratio10 : 1
                 Max copper thickness6 OZ
                 Max dimension600 * 700mm
                 Min thickness of 4 layers PCB0.4 mm
                 Min hole / pad0.15 / 0.35mm
                 Hole location accuracy+ / - 0.05mm
                 PTH hole tolerance+ / - 0.05mm
                 Min line width and line space0.065 / 0.065mm

 

                Surface treatment

 

HASL / HASL lead free, OSP

 

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

 

silver plating, tin plating, platinum plating, carbon ink,

 

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

 

 

 

 

        Lead Time

 
Layer countSample lead time/workdayBatch lead time/workday
1-2L26
4L58
6L59
8L610
10L810
12L812
14L1015
16L1018
18-40L (Up to difficulty)at least 18at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

 


 

        What kinds of test function will be offered?

 

 
           AOI (Automated Optical Inspection)      Impedance control
           Automatic short-circuit testing      Metallographic microscope
           RoHS detector      Fly probe/ fixture mold
           Dielectric tester      Visual inspection

 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - Double Sided PCB

Double Sided PCBs also known as Double-Sided Plated Thru or DSPT, which are the gateway to higher technology applications compared to single sided PCB. 

Double Sided PCB allow for the routing of traces around each other by jumping between a top and bottom layer by way of vias. 

The ability to cross paths from top to bottom greatly increasing the circuit designer's flexibility in circuits designing and lends itself to greatly increased circuit densities. 

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