Active Member
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[China]
Address: A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway
Contact name:Cyan Hong
Shenzhen Lefang Electronics Co., Ltd |
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Rogers 2.0mm 3 OZ Immersion Gold Heavy Copper PCB Printed Circuit Board
For the thick copper PCB Board, it is usually allow higher current to go through. The layer count of this heavy copper PCB is 2 and the copper thickness is 3 OZ / 105 µm. Also, the surface treatment of this thick copper PCB Board is Immersion Gold. Its minimum aperture is 0.4 mm, and the line width and space are 0.8 mil.
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others | ||||||||||||||||||||
| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
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SAMPLE:
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| Item | Details |
| Max layer count | 20 L |
| Max board thickness | 6.0 mm |
| Max aspect ratio | 10 : 1 |
| Max copper thickness | 6 OZ |
| Max dimension | 600 * 700mm |
| Min thickness of 4 layers PCB | 0.4 mm |
| Min hole / pad | 0.15 / 0.35mm |
| Hole location accuracy | + / - 0.05mm |
| PTH hole tolerance | + / - 0.05mm |
| Min line width and line space | 0.065 / 0.065mm |
| Surface treatment | HASL / HASL lead free, OSP
Immersion gold/silver/tin, gold plating (hard gold and soft gold),
silver plating, tin plating, platinum plating, carbon ink,
ENEPIG (electroless nickel - electroless palladium - immersion gold) |
Lead Time
| Layer count | Sample lead time/workday | Batch lead time/workday |
| 1-2L | 2 | 6 |
| 4L | 5 | 8 |
| 6L | 5 | 9 |
| 8L | 6 | 10 |
| 10L | 8 | 10 |
| 12L | 8 | 12 |
| 14L | 10 | 15 |
| 16L | 10 | 18 |
| 18-40L (Up to difficulty) | at least 18 | at least 24 |
| P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays | ||
-- We have spent massively on purchasing below advanced automated production equipments.
| Equipment Name | Plant in Shenzhen | Plant in Dongguan |
| CCD exposure machine | 8 | 12 |
| AOI test machine | 6 | 8 |
| Mechanical drilling rig | 26 | 53 |
| Automatic edge finishing machine | 2 | 2 |
| Pressing machine | 2 | 2 |
| VCP | 0 | 2 |
| Electroplating line | 1 | 2 |
| CNC routing machine | 12 | 12 |
| Automatic tester | 10 | 16 |
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the
next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base
platform of double sided plated.
This methodology would again allow circuit board designers a
dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern
computing, and their basic construction and fabrication are similar
to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy
glass to exotic ceramic fills, and it can be built on ceramic,
copper, and aluminum. Also, blind and buried vias are commonly
produced in multilayer pcb manufacturing, along with pad on via
technology.
