Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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| PCB Description | Our PCB Board Capability | ||
| PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver | ||
| PCB Max. Size | 1200mm×600mm | ||
| PCB Min. Size | 5mm×5 mm | ||
| Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% | ||
| Min. Board Thickness & Tolerance | 0.2mm±0.08mm | ||
| PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) | ||
| gold board:0.075mm±20%(3mil±0%) | |||
| Copper to Board Edge Spacing | 0.5mm(20mil) | ||
| Hole to Trace Spacing | 0.3mm(12mil) | ||
| Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) | ||
| Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) | ||
| Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) | ||
| Hole Location Tolerance | ±0.076mm(l±3mil) | ||
| Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) | ||
| FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |||
| PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) | ||
| FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |||
| Trace width variation | ±0.076mm(±3mil) | ||
| Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) | ||
| V-CUT Registration Tolerance±0.2mm (±8mil) | |||
| PCB BOARD Type | Single-sided, double-sided, multi-layer | ||
| Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base | ||
| PCB BOARD Thickness | 0.2-3.5mm | ||
| Base Copper Thickness | 11um 35um 70um 105um | ||
| Max. aspect ratio(board thickness: hole size) | 8:1 | ||
| V-Cut Angle Tolerance | ±5° | ||
| V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) | ||
| Min SMT Pitch | 0.3mm(12mil) | ||
| Min. Component mark | 0.15mm(6mil) | ||
| Min. width of annular ring(finished) | 0.15mm(6mil)/side | ||
| Min pad opening | 0.076mm(3mil) | ||
| Min S/M Bridge | ±0.076mm(±3mil) | ||
| carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times | |||
| Technology | |||
| Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
| Min drill size for through hole | drill 8.0 mil0.20mm | ||
| Laser dill | 4 mil0.1mm | ||
| Copper Foil Thickness | 17-210um | ||
| Inner Core Thickness | ±0.08mm | ||
| Tolerance of total board thickness | ±0.015mm | ||
| Max .Unit Area | 700-800 | ||
| Min. Unit Area | 2-5mm | ||
| Max Layer | 1-18 Layers | ||
| Surface Treatment | |||
| Solder Coating Thickness Sn | 4-20um | ||
| Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
| Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
| OSP Coating Thickness | 0.2-0.5um | ||
| Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
| Chem .Tin Thickness | Sn:0.8-5um | ||
| Producting Capacity | each day :800-100m2 | ||
| Aspect Ratio | 6:01:00 | ||
| Hole Registration | 0.004" (0.1mm) |
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Rigid-Flex Board
Layers count: 2- 20
Min Line width/spacing(mil): 2.5/2.5
Max Aspect Ratio: 22:1
Board thickness: 0.13-7.0mm
Max Panel size: 23"x35"
Material: FR-4,High Frequency
Surface Treatment: Immersion Gold,Golden Finger
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