Shenzhen Found Printed Circuit Board Co., Ltd. |
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Product Name | PCB Circuit Board |
Type | Rigid, Flexible, Rigid-Flexible |
Material | FR4, CEM1, CEM3, Aluminum, High Frequency Board, |
Layer | 1,2,4,6...24Layer |
Shape | Retangular, Round, Slots, Cutouts, Complex, Irregular |
Cutting | Shear, V-score, Tab-routed |
Board Thickness | 0.2-4mm, regular 1.6mm |
Copper Thickness | 0.5-4oz, regular 1oz |
Solder Mask | Green, Red, Blue, Yellow, etc. |
Silk Screen | White, Black, etc. |
Silk Screen Min Line Width | 0.075mm |
Min Trace/Gap | 0.075mm |
Min Drill Hole Diameter | 0.2mm |
Surface Finish | HASL, ENIG, OSP, etc. |
Product capability
Seq | Item | capability |
1 | Base Material | FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc |
2 | Layers | 1-40 ( ≥30 layers needs review ) |
3 | Finished inner/outer copper thickness | 0.5-6OZ |
4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% | ||
5 | Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
6 | Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
7 | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil | ||
8 | Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
10 | Aspect Ratio | 15:01 |
11 | Min welding ring | 4mil |
12 | Min solder mask bridge | ≥0.08mm |
13 | Plugging vias capability | 0.2-0.8mm |
14 | Hole tolerance | PTH: +/-3mil NPTH: +/-2mil |
15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
16 | Solder mask color | Green,yellow,black,blue,red,white,matte green |
17 | Component mark color | white,yellow,black |
18 | Surface treatment | OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U'' ENEPIG: PB 2-5U''/ Au 1-8U'' Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U'' |
19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
Min spacing from test pad to board edge : 0.5 mm | ||
Min conductive resistance : 5 Ω | ||
Max insulation resistance : 250 MΩ | ||
Max test voltage : 500 V | ||
Min test pad diameter : 6 mil | ||
Min test pad to pad spacing : 10 mil | ||
Max test current : 200 MA | ||
20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch |
FAQ
Q: Are you amanufacturer?
A: Yes we are manufacturer.
Q: Do you provide samples?
A: Yes we can provide free samples, price and shipping cost open
for negotiation.
Q: What certificates does this product have?
A: We have CE, FCC, ROHS certified.
Q: What about OEM and ODM?
A: We accept OEM and ODM orders, MoQ is open for discussion.
Q: What is depvery terms and time?
A: We use FOB terms and ship the goods in 7-30 days depend on your
order quantity, customization.