Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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Product Description
Specification:
Layer4
MaterialFR4
Board Thickness1.6mm
Copper Thickness1oz
Solder MaskGreen
SilkscreenWhite
Surface FinishHASL
Model NO.: RCT-Rigid flex pcb Solder
Mask: Green
Silkscreen: White
Surface Treatment: Immersion Gold
Other Specification: HDI PCB
Origin: China
HS Code: 85340010
Rigid Flex PCB boards are composed of a combination of rigid and
flexible printed circuit boards that are connected to one another
by lamination. so most of the rigid flex PCB are made of multiple
layers of flexible circuit substrates attached to one or more layer
rigid boards internally or externally, depending upon your design
requirements
At present rigid flex PCB is applied in more and more applications,
as it can offers optimum solutions for limited installation space
conditions. and also rigid flex PCB can provide the possibility of
secure and high electrical connection performance of the device
components with the assurance of contact stability, as well as a
reduction in plug and connector components.
RCT own excellent rigid flex PCB manufacturing technologies, our experts have been focus on the research of rigid flex PCB production for many years, and are the owner of 20+ innovative patents, our rigid flex PCB products are featured with the high quality, reliability and also competitive cost, so we are the leading rigid flex PCB supplier in China, now we can make ultra thin 0.25mm 4 Layers Rigid Flex PCB and up to 24 Layer Rigid Flex PCB.
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| PCB Description | Our PCB Board Capability | ||
| PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver | ||
| PCB Max. Size | 1200mm×600mm | ||
| PCB Min. Size | 5mm×5 mm | ||
| Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% | ||
| Min. Board Thickness & Tolerance | 0.2mm±0.08mm | ||
| PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) | ||
| gold board:0.075mm±20%(3mil±0%) | |||
| Copper to Board Edge Spacing | 0.5mm(20mil) | ||
| Hole to Trace Spacing | 0.3mm(12mil) | ||
| Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) | ||
| Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) | ||
| Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) | ||
| Hole Location Tolerance | ±0.076mm(l±3mil) | ||
| Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) | ||
| FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |||
| PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) | ||
| FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |||
| Trace width variation | ±0.076mm(±3mil) | ||
| Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) | ||
| V-CUT Registration Tolerance±0.2mm (±8mil) | |||
| PCB BOARD Type | Single-sided, double-sided, multi-layer | ||
| Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base | ||
| PCB BOARD Thickness | 0.2-3.5mm | ||
| Base Copper Thickness | 11um 35um 70um 105um | ||
| Max. aspect ratio(board thickness: hole size) | 8:1 | ||
| V-Cut Angle Tolerance | ±5° | ||
| V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) | ||
| Min SMT Pitch | 0.3mm(12mil) | ||
| Min. Component mark | 0.15mm(6mil) | ||
| Min. width of annular ring(finished) | 0.15mm(6mil)/side | ||
| Min pad opening | 0.076mm(3mil) | ||
| Min S/M Bridge | ±0.076mm(±3mil) | ||
| carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times | |||
| Technology | |||
| Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
| Min drill size for through hole | drill 8.0 mil0.20mm | ||
| Laser dill | 4 mil0.1mm | ||
| Copper Foil Thickness | 17-210um | ||
| Inner Core Thickness | ±0.08mm | ||
| Tolerance of total board thickness | ±0.015mm | ||
| Max .Unit Area | 700-800 | ||
| Min. Unit Area | 2-5mm | ||
| Max Layer | 1-18 Layers | ||
| Surface Treatment | |||
| Solder Coating Thickness Sn | 4-20um | ||
| Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
| Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
| OSP Coating Thickness | 0.2-0.5um | ||
| Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
| Chem .Tin Thickness | Sn:0.8-5um | ||
| Producting Capacity | each day :800-100m2 | ||
| Aspect Ratio | 6:01:00 | ||
| Hole Registration | 0.004" (0.1mm) | ||
Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days,
above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
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