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PCBA for Multilayer Printed Circuit Board with Prototype Circuit Board

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Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen

Contact name:Frank

Shenzhen Found Printed Circuit Board Co., Ltd.

PCBA for Multilayer Printed Circuit Board with Prototype Circuit Board

Country/Region	china
City & Province	shenzhen guangdong
Categories	Solar Chargers

Product Details

PCBA for Multilayer Printed Circuit Board with Prototype Circuit Board

Introduction

Shenzhen Found Printed circuit Board co.,Ltd,established in 2010, has been playingleading role as a professional manufacturer of all kinds of highprecision PCBs in the past decades. With the ongoing investment in research, equipment and updating system of management, we have enjoyed a sound reputation in the field of PCB, and stand out in today’s market with fierce competition. Located in Shenzhen, our company has about 200 staff and a PCB workshop with about 8000 square meters. Our products are mostly used in the field of LED Linghting, and have good performance in all kind of functional test. Our perfect management, advanced equipments, and professional staffs are the keys for us to fight to win more market shares with other competitors. Customer‘s satisfaction and support are what we have been strived for. Now we have passed ISO9001, ISO14001, SGS and UL certificates. With constant hard work of our staff and ongoing support from customers both home and abroad, we can provide up to 24 layer, 6oz copper, High TG, AL-base to our customers with fast turn and high quality level.

Pls see our pcb catalog below:
1. single side pcb 2. double side pcb
3. Multilayer pcb(3-26+ layers) 4. Flexible PCB(FPC)
5. Rigid-flex PCB board 6. Aluminum PCB board for LED(1-4 layers)
7. MCPCB board (1-4 layers) 8.Ceramic PCB(1-4 layers)
9. HDI pcb board 10. High frequency PCB
11. PCB assembly

PCB Description		Our PCB Board Capability
PCB Surface Finishes		electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size		1200mm×600mm
PCB Min. Size		5mm×5 mm
Bow & Twist Tolerance		Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance		0.2mm±0.08mm
PCB Min. trace/spacing		Tin board:0.2mm±20%(8mil±0%)
		gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing		0.5mm(20mil)
Hole to Trace Spacing		0.3mm(12mil)
Min. Hole Diameter		0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance		0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall		20-25um(0.79mil-1.0mil)
Hole Location Tolerance		±0.076mm(l±3mil)
Min Diameter of Punching Hole		FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
		FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching Slot		FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
		FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation		±0.076mm(±3mil)
Outline Tolerance		Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
		V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD Type		Single-sided, double-sided, multi-layer
Major Material		FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness		0.2-3.5mm
Base Copper Thickness		11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)		8:1
V-Cut Angle Tolerance		±5°
V-Cut Board Thickness		0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch		0.3mm(12mil)
Min. Component mark		0.15mm(6mil)
Min. width of annular ring(finished)		0.15mm(6mil)/side
Min pad opening		0.076mm(3mil)
Min S/M Bridge		±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
	Technology
	Min trace/space(inner/external)	3/3 mil0.075/0.075mm
	Min drill size for through hole	drill 8.0 mil0.20mm
	Laser dill	4 mil0.1mm
	Copper Foil Thickness	17-210um
	Inner Core Thickness	±0.08mm
	Tolerance of total board thickness	±0.015mm
	Max .Unit Area	700-800
	Min. Unit Area	2-5mm
	Max Layer	1-18 Layers
	Surface Treatment
	Solder Coating Thickness Sn	4-20um
	Cobalt/ Gold plating, Hard Gold Thickness	Ni:5-10umAu:0.05-0.20um
	Gold/Nickel Plating Thickness	Ni:5-10umAu:0.05-0.15um
	OSP Coating Thickness	0.2-0.5um
	Electroness Au Thickness	Ni:3-15umAu:0.025-0.10mm
	Chem .Tin Thickness	Sn:0.8-5um
	Producting Capacity	each day :800-100m2
	Aspect Ratio	6:01:00
	Hole Registration	0.004" (0.1mm)

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement