Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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| PCB Description | Our PCB Board Capability | ||
| PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver | ||
| PCB Max. Size | 1200mm×600mm | ||
| PCB Min. Size | 5mm×5 mm | ||
| Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% | ||
| Min. Board Thickness & Tolerance | 0.2mm±0.08mm | ||
| PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) | ||
| gold board:0.075mm±20%(3mil±0%) | |||
| Copper to Board Edge Spacing | 0.5mm(20mil) | ||
| Hole to Trace Spacing | 0.3mm(12mil) | ||
| Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) | ||
| Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) | ||
| Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) | ||
| Hole Location Tolerance | ±0.076mm(l±3mil) | ||
| Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) | ||
| FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |||
| PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) | ||
| FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |||
| Trace width variation | ±0.076mm(±3mil) | ||
| Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) | ||
| V-CUT Registration Tolerance±0.2mm (±8mil) | |||
| PCB BOARD Type | Single-sided, double-sided, multi-layer | ||
| Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base | ||
| PCB BOARD Thickness | 0.2-3.5mm | ||
| Base Copper Thickness | 11um 35um 70um 105um | ||
| Max. aspect ratio(board thickness: hole size) | 8:1 | ||
| V-Cut Angle Tolerance | ±5° | ||
| V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) | ||
| Min SMT Pitch | 0.3mm(12mil) | ||
| Min. Component mark | 0.15mm(6mil) | ||
| Min. width of annular ring(finished) | 0.15mm(6mil)/side | ||
| Min pad opening | 0.076mm(3mil) | ||
| Min S/M Bridge | ±0.076mm(±3mil) | ||
| carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times | |||
| Technology | |||
| Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
| Min drill size for through hole | drill 8.0 mil0.20mm | ||
| Laser dill | 4 mil0.1mm | ||
| Copper Foil Thickness | 17-210um | ||
| Inner Core Thickness | ±0.08mm | ||
| Tolerance of total board thickness | ±0.015mm | ||
| Max .Unit Area | 700-800 | ||
| Min. Unit Area | 2-5mm | ||
| Max Layer | 1-18 Layers | ||
| Surface Treatment | |||
| Solder Coating Thickness Sn | 4-20um | ||
| Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
| Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
| OSP Coating Thickness | 0.2-0.5um | ||
| Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
| Chem .Tin Thickness | Sn:0.8-5um | ||
| Producting Capacity | each day :800-100m2 | ||
| Aspect Ratio | 6:01:00 | ||
| Hole Registration | 0.004" (0.1mm) | ||
1. Technical Capacity of PCB Manufacturing
2. Detailed Terms for Pcb Assembly
PCB or PCB Assembly files requests
1) Gerber files of the PCB Board
2) BOM(Bill of material) for assembly
To short the lead time,please kindly advertise us if there is any
acceptable components substitution.
3) Testing method & Test fixtures if necessary.
4) programming files & programming tool if necessary
5) Schematic if necessary
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