Shenzhen Found Printed Circuit Board Co., Ltd. |
|
Items | Speci. | |
Max panel size | 32" x 20.5"(800mm x 520mm) | |
Min trace width/ space (inner layer) | 4mil / 4mil(0.1mm / 0.1mm) | |
Min PAD (inner layer) | 5 mil(0.13mm) | |
Min thickness(inner layer) | 4 mil(0.1mm) | |
Inner copper thickness | 1~ 4 oz | |
Outer copper thickness | 0.5 ~ 6 oz | |
Finished board thickness | 0.4 - 3.2 mm | |
Board thickness tolerance control | ± 0.1mm | ± 0.10 mm |
± 10% | ± 10 % | |
± 10% | ± 10 % | |
Inner layer treatment | brown oxidation | |
Layer count Capability | 1-30 LAYER | |
alignment between ML | ±2mil | |
Min drilling | 0.15 mm | |
Min finished hole | 0.1 mm | |
Hole precision | ± 2 mil( ± 50 um) | |
tolerance for Slot | ± 3 mil( ± 75 um) | |
tolerance for PTH | ± 3 mil( ± 75um) | |
tolerance for NPTH | ± 2mil( ± 50um) | |
Max Aspect Ratio for PTH | 8:1 | |
Hole wall copper thickness | 15-50um | |
Alignment of outer layers | 4mil / 4mil | |
Min trace width/space for outer layer | 4mil / 4mil | |
Tolerance of Etching | + / - 10 % | |
Thickness of solder mask | on trace | 0.4 - 1.2 mil(10 - 30 um) |
at trace corner | ≥ 0.2 mil(5 um) | |
On base material | ≤ + 1.2 mil Finished thickness | |
Hardness of solder mask | 6H | |
Alignment of solder mask film | ± 2mil( + / - 50um) | |
Min width of solder mask bridge | 4mil(100um) | |
Max hole with solder plug | 0.5mm | |
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
Max Nickel thickness for Gold finger | 280u"(7um) | |
Max gold thickness for Gold finger | 30u"(0.75um) | |
Nickel thickness in Immersion Gold | 120u" / 240u"(3um / 6um) | |
Gold thickness in Immersion Gold | 2u" / 6u"(0.05um / 0.15um) | |
Impedance control and its tolerance | 50 ± 10%,75 ± 10%,100 ± 10% 110 ± 10% | |
Trace Anti-stripped strength | ≥ 61B / in( ≥ 107g / mm) | |
bow and twist | 0.75% |
If you send Gerber files to us, you will get the best price and lead times.
We are looking forward to you order.
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