Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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Carbon Oil CEM3 CEM1 PCB
Port: | Shenzhen, China |
Production Capacity: | 90000sqmeters/Month |
Payment Terms: | L/C, T/T, D/P, Western Union, Paypal, Money Gram |
Structure: | Double-Sided Rigid PCB |
Dielectric: | FR-4 |
Material: | Polyester Glass Fiber Mat Laminate |
Application: | Consumer Electronics |
Flame Retardant Properties: | V0 |
Processing Technology: | Electrolytic Foil |
Technology capability
Items | Single/Double-sided Board/Multilayer Board/FPC(1-24Layer) | ||
| Base Materials | FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo | ||
| Finish copper thickness | Outer 6 OZ,Inner 4 OZ | ||
| Surface finish | ENIG, ImAg, ImSn, OSP, HASL,Plating gold | ||
| Finished Board Size | Max Double-sided Board | 640mm 1100mm | |
| Max Multilayer Board | 640mm 1100mm | ||
| Finished Board Hole Size (PTH Hole) | Min Finished Board Hole Size | 0.15mm | |
| Conductor Width and Spacing | Min Conductor Width | 0.01mm | |
| Min Conductor Spacing | 0.01mm | ||
| Thickness of Plating and Coating Layer | PTH Wall Copper Thickness | >0.02mm | |
| Tin Solder Thickness ( Hot Air Leveling ) | >0.02mm | ||
| Nickl/Gold Thickness | For customer special need | ||
| Nickl Plating Layer | >2um | ||
| Gold Plating Layer | >0.3um | ||
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
| PCB Type | Single-side pcb , Double side pcb , Multilayer pcb , Aluminum base
PCB HDI board pcb , High Tg pcb and so on |
| Base Material | XPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on |
| Layer No . | 1-18 Layers |
| Surface Finish | HASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink |
| Silk Screening | In any color such as green ,white ,nlue ,red , black and so on |
| Certificate | ISO9001,ISO14001,ISO-TS, UL,ROHS |
| Testing | Electrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test |
| Environment | Clean room environmen , Dust-free workshop |
| Transportation | Fedex ,DHL,UPS and so on |
| Files | Gerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc |
Delivery Time for FPC board
1) FPC production time: Sample: 2-3 days / mass production: Within
7 days
2) Components purchase: 2 days if all components is available in
our domestic market.
3) FPC Assembly: Samples: Whthin 2 days / mass production: Within 5
days
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