Active Member
|
[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
|
|
Immersion Gold Heavy Copper PCB
Port: | Shenzhen, China |
Production Capacity: | 50000piece/Month |
Payment Terms: | T/T, Western Union, Paypal, Money Gram |
Structure: | Fr4 PCB Immersion Gold |
Dielectric: | FR-4 |
Material: | Immersion Gold |
Application: | Consumer Electronics |
Flame Retardant Properties: | V0 |
Processing Technology: | Delay Pressure Foil |
Technical capabilities:
| Item | Details |
| Max layer count | 20L |
| Max board thickness | 6.0mm |
| Max aspect ratio | 10:1 |
| Max copper thickness | 6OZ |
| Max dimension | 600x700mm |
| Min thickness of 4 layers PCB | 0.4mm |
| Min hole/ pad | 0.15/0.35mm |
| Hole location accuracy | +/-0.05mm |
| PTH hole tolerance | +/-0.05mm |
| Min line width and line space | 0.065/0.065mm |
| Surface treatment | HASL/HASL lead free, OSP, Immersion gold/silver/tin, gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, and ENEPIG(electroless nickel - electroless palladium - immersion gold) |
We specilized in
Ucreate is specialized in the production of a variety of single,
double, high multi layers, HDI, the metallic substrate and FPC PCB.
With laser drilling machine, CNC drilling machine, automatic
machine, automatic exposure machine, large-scale lamination
machine, Automatic flow production line, auto panel plating line,
auto P.T.H Line, and other precision production equipments and AOI
testing machine, flying probe tester machine and other advanced
detection equipments.
Heavy Copper Edge Plating PCB Hard Gold PCB
Hard Gold Rogers4350B TG150 PCB
PCB Assembly Chloromatic ESR200 PCB
OSP PCB FR406 TG170 PCB
1L Layers Flex PCB
Polyimide 50um Flex PCB Board
| Port: | Shenzhen, China |
| Production Capacity: | 50000pieces/Month |
| Payment Terms: | L/C, T/T, Western Union, Paypal, Money Gram |
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | V0 |
| Mechanical Rigid: | Rigid |
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
Your Name: | |
*E-mail: | |
Phone: | |
Company: | |
Title: | |
*Content: | |
Send |
