Shenzhen Found Printed Circuit Board Co., Ltd. |
|
Edge Plating ITEQ KB PCB
Port: | Shenzhen, China |
Production Capacity: | 90000sqmeters/Month. |
Payment Terms: | L/C, T/T, D/P, Western Union, Paypal, Money Gram |
Structure: | Double-Sided Rigid PCB |
Dielectric: | FR-4 |
Material: | Polyester Glass Fiber Mat Laminate |
Application: | Consumer Electronics |
Flame Retardant Properties: | V0 |
Processing Technology: | Electrolytic Foil |
Specification:
Layer | 2 |
Material | FR4-TG 150 |
Board Thickness | 1.6mm |
Copper Thickness | 1oz |
Soldermask | Green |
Silkscreen | White |
Surface Finishing | Lead Free HAL |
Min Line Width/Space | 4/4 mil |
Min Hole Size | 0.2mm |
Applications
1) Through hole,BGA package on multilayer PCBs -->via on ball
-->resin via plug -->ground surface -->copper
electroplated on plugged via.
2) Blind via, a technique similar to a through hole, with a
controlled depth of 0.075mm for the blind hole.
3) HDI multi-step stacking hole technology.The interconnected
processing technology is very complex. Multiple hole filling and
multiple copper pressing are used to complete the manufacturing
process.Such structure in medical, communication products are
widely recommended for application.
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PCB Manufacture Capability | |
Item | Manufacture Capability |
Layers | 1-26 Layers |
HDI | 2+N+2 |
Material Types | Fr-4,Fr-5,High-Tg,Aluminum Based , Halogen Free, |
Isola,Taconic,Arlon,Teflon,Rogers, | |
Max.Panel Dimension | 39000mil * 47000mil (1000mm * 1200mm) |
Outline Tolerance | ± 4mil (± 0.10mm) |
Board Thickness | 8mil-236mil (0.2 - 6.0mm) |
Board Thickness Tolerance | ± 10% |
Dielectric Thickness | 3mil-8mil ( 0.075mm-0.20mm) |
Min.Track Width | 3mil ( 0.075mm ) |
Min.Track Space | 3mil ( 0.075mm ) |
External Cu Thickness | 0.5 OZ - 10 OZ ( 17um - 350um) |
Internal Cu Thickness | 0.5OZ - 6OZ ( 17um - 210um) |
Drilling Bit Size ( CNC ) | 6mil-256mil ( 0.15mm - 6.50mm) |
Finished Hole Dimension | 4mil-236mil(0.1mm - 6.0mm) |
Hole Tolerance | ± 2mil (± 0.05mm) |
Laser Drilling Hole Size | 4mil(0.1mm) |
Aspect Ration | 16: 1 |
Solder Mask | Green,Blue,White,Black,Red,Yellow,Purple,etc. |
Min Solder mask Bridge | 2mil(0.050mm) |
Plugged Hole Diameter | 8mil-20mil ( 0.20mm-0.50mm) |
Beveling | 30o - 45o |
V-scoring | +/-0.1mm,15o30o45o60o |
Impedance Control | Min. 5%General10% |
Surface Finishing | HASL,HASL(lead Free),Immersion Gold |
Immersion Silver,OSP,Hard Gold ( up to 100u" ) | |
Certification | UL RoHS ISO9001: 2000 ISO14000: 2004 SGS |
Quality Standards | Accept spcifications of customer and IPC(class II or III) |
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