Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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Hard Gold ITEQ KB PCB
Port: | Shenzhen, China |
Production Capacity: | 90000sqmeters/Month |
Payment Terms: | L/C, T/T, D/P, Western Union, Paypal, Money Gram |
Structure: | Double-Sided Rigid PCB |
Dielectric: | FR-4 |
Material: | Polyester Glass Fiber Mat Laminate |
Application: | Consumer Electronics |
Flame Retardant Properties: | V0 |
Processing Technology: | Electrolytic Foil |
PRODUCTION CAPACITY
| Items | Parameter | Special | ||
| Layers Counts | 2-20 | |||
| Board material | FR-4,Aluminum | High Tg FR4 | ||
| max Fabrication area | 580×700mm | 500mm×3000mm | ||
| Board thickness | 0.1-3.2mm | |||
| Camber | Double Side multi -layers | d ≤0.075mm d ≤1% | d≤0.05mm | |
| Impedance | ±7% | ±5% | ||
| PTH tolerance | d>5.0 | ±0.076mm | ||
| 0.3<d≤5.0 | ±0.05mm | |||
| d≤0.3 | ±0.08mm | |||
| Min finished hole size | 0.15mm | |||
| Hole copper thickness | ≥20um | |||
| Min track width, spacing | 0.05mm ×0.05mm | |||
| Profile size | ±0.1mm | ±0.05mm | ||
| Profile | Routing,Punch,Cut,V-cut,Chanfer | |||
| Surface finish | Immersion Gold:0.025~0.075um | |||
| Gold finger:≥0.13 um | ≥1.0 um | |||
| OSP:0.2-0.5µm | ||||
| HAL:5~20 um | ||||
| LEADFREE HAL:5~20 um | ||||
| Surface plating | Solder mask: Black Green White Red Thickness≥17 um,Block,BGA | |||
| Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | ||||
| Ppeelable mask: red bule thickness≥300 um | ||||
| Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm | ||||
Basic elements that affect impedance
1) Thickness of trace (T1) 7%
2) Width of trace (W1) 4%
3) Height of laminate (H1) 35%
4) Dielectric constant of board material (Er1) 8%
5) Other factors can be involved, however they have much less
affect on the impedance such solder resist, thickness of tin and
lead, PCB humidity etc
Main factors affected impedance control (normally ±10%)
1) Generally, desinged width of trace is already fixed,
manufacturing procedure is controlled within ±15-20%
2) Generally, the thickness of trace is already fixed at designing
period, manufacturing procedure of electroplate is controlled
within ±0.8-1.2mil
3) The dielectric constant of the substrate is almost fixed, no
much big changes.
4) The above-mentioned factors can be controlled stably, the main
affecting factor of impedance control is only left height of
laminate.
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