Active Member
|
[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
|
|
We specilized in
Ucreate is specialized in the production of a variety of single,
double, high multi layers, HDI, the metallic substrate and FPC PCB.
With laser drilling machine, CNC drilling machine, automatic
machine, automatic exposure machine, large-scale lamination
machine, Automatic flow production line, auto panel plating line,
auto P.T.H Line, and other precision production equipments and AOI
testing machine, flying probe tester machine and other advanced
detection equipments.
metal core PCB Copper base PCB
Fr4 Rigid 1.6mm Single Layers Fiberglass Epoxy PCB
Metal Core Circuit Board Round Aluminum LED PCBA
Double Side Rigid Flex PCB HASL Rohs PCB
94vo Fr4 Single Side PCB Manufacturer Printed Circui...
Automatic SMT Assembly PCB Industrial Control PCBA
| Port: | Shenzhen, China |
| Production Capacity: | 50000pieces/Month |
| Payment Terms: | L/C, T/T, Western Union, Paypal, Money Gram |
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | V0 |
| Mechanical Rigid: | Rigid |
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
Your Name: | |
*E-mail: | |
Phone: | |
Company: | |
Title: | |
*Content: | |
Send |
