Shenzhen Found Printed Circuit Board Co., Ltd. |
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PCB generally consists of four layers, which are heat laminated together into a single layer. The material used in PCB from top to bottom includes Silkscreen, Soldermask, Copper and Substrate.
The last of those layers, substrate, is made of fiberglass with the FR letters standing for "fire retardant." This substrate layer provides a solid foundation for PCBs, though the thickness can vary according to the uses of a given board.
A cheaper range of boards also exist on the market that don't utilize the same aforementioned PCB materials, but instead consist of phenolics or epoxies. Due to the thermal sensitivity of these boards, they tend to lose their lamination easily. These cheaper boards are often easy to identify by the smell they give off when being soldered.
PCB second layer is copper, which is laminated onto the substrate with a mixture of heat and adhesive. The copper layer is thin, and on some boards there are two such layers - one above and one below the substrate. PCBs with only one layer of copper tend to be used for cheaper electronics device.
Product Description
Fastline High quality Fr4 PCB circuit board:
Features-Our Products Advantage
1. Over 10 years experience manufacturer in pcb prototyping board
and pcb field.
2. Big scale of producing makes sure that your purchase cost is
lower.
3. Advanced production line guarantees stable quality and long life
span.
4. Design and produce almost any PCB as your requirement.
5. 100% test for all products
PCB advantages:
1 R&D team support
2 UL, RoHS,ISO9001
3.IPC class2
4.Advanced production line and promtly delivery.
5,Honest Credibility in China.
6.Professional and abundant experience in PCB.
7.Competitive price and good quality.
8. Excellent after-sales service.
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Multilayer Rigid Printed Circuit Board Rigid-Flex 4 ...
Port: | Shenzhen, China |
Production Capacity: | 50000pieces/Month |
Payment Terms: | L/C, T/T, Western Union, Paypal, Money Gram |
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy Resin + Polyimide Resin |
Application: | Consumer Electronics |
Flame Retardant Properties: | V0 |
Mechanical Rigid: | Rigid |
Product Description:
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max | 600*1000mm (24"x40") |
Min | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, B |
PCB Type | Single-side pcb , Double side pcb , Multilayer pcb , Aluminum base
PCB HDI board pcb , High Tg pcb and so on |
Base Material | XPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on |
Layer No . | 1-18 Layers |
Surface Finish | HASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink |
Silk Screening | In any color such as green ,white ,nlue ,red , black and so on |
Certificate | ISO9001,ISO14001,ISO-TS, UL,ROHS |
Testing | Electrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test |
Environment | Clean room environmen , Dust-free workshop |
Transportation | Fedex ,DHL,UPS and so on |
Files | Gerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc |
PCB Type | Single-side pcb , Double side pcb , Multilayer pcb , Aluminum base
PCB HDI board pcb , High Tg pcb and so on |
Base Material | XPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on |
Layer No . | 1-18 Layers |
Surface Finish | HASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink |
Silk Screening | In any color such as green ,white ,nlue ,red , black and so on |
Certificate | ISO9001,ISO14001,ISO-TS, UL,ROHS |
Testing | Electrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test |
Environment | Clean room environmen , Dust-free workshop |
Transportation | Fedex ,DHL,UPS and so on |
Files | Gerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc |
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