Active Member
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[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
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we have some outstanding products as follows:
1. Carbon Built on PCB:Apply for Thick Film Technology to make the PCB with buried
resistors or touch pad function.
2. Thin PCB:Less than 16 mil thickness in 4 or 6 layers FR-4 production is
another challenge for our production capability.
3. CSP / BGA PCB:Those kinds of PCB are increasing and we expect the quantity will
be over 10% of our production in coming years.
4. Special Service: In addition to devote in normal PCB process, our engineering team
also provide design support as requested by clients
Rogers PCB Control Impedance PCB
TG170 PCB GBA PCB Rogers4350B PCB
6 Layers Rigid Flex PCB 0.15MM Hole
Single Side Flex Printed Super Conductive Electronic...
FR4 With Deep Control SLOT
Copper Core Pcb Mirror Aluminum Al-core Pcb Mcpcb
Product Description:
| 1 | Layer Count | 1-30Layers | |
| 2 | HDI Type | 1+N+1, 2+N+2 | |
| 3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
| 4 | Board thickness | 0.2~5.0mm | |
| 5 | Board Size | Max | 600*1000mm (24"x40") |
| Min | 30x50mm | ||
| 6 | Copper Thickness | Outer layer | 1oz~6oz |
| Inner layer | Hoz~5oz | ||
| 7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
| 8 | Finished Hole size | Mechanical | 0.20~6.30mm |
| Laser | 5mil, 6mil | ||
| 9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
| 10 | Aspect Ratio | 10:1 | |
| 11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
| NPTH | ±0.05mm (2mil) | ||
| 12 | Hole Position Tolerance | ±0.05mm (2mil) | |
| 13 | Bow & Twist | ≤0.75% | |
| 14 | Peel strength | 1.4N/mm | |
| 15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
| 16 | Test Voltage | 50-300V | |
| 17 | Soldermask color | Green, Red, B | |
PRODUCTION CAPACITY
| Items | Parameter | Special | ||
| Layers Counts | 2-20 | |||
| Board material | FR-4,Aluminum | High Tg FR4 | ||
| max Fabrication area | 580×700mm | 500mm×3000mm | ||
| Board thickness | 0.1-3.2mm | |||
| Camber | Double Side multi -layers | d ≤0.075mm d ≤1% | d≤0.05mm | |
| Impedance | ±7% | ±5% | ||
| PTH tolerance | d>5.0 | ±0.076mm | ||
| 0.3<d≤5.0 | ±0.05mm | |||
| d≤0.3 | ±0.08mm | |||
| Min finished hole size | 0.15mm | |||
| Hole copper thickness | ≥20um | |||
| Min track width, spacing | 0.05mm ×0.05mm | |||
| Profile size | ±0.1mm | ±0.05mm | ||
| Profile | Routing,Punch,Cut,V-cut,Chanfer | |||
| Surface finish | Immersion Gold:0.025~0.075um | |||
| Gold finger:≥0.13 um | ≥1.0 um | |||
| OSP:0.2-0.5µm | ||||
| HAL:5~20 um | ||||
| LEADFREE HAL:5~20 um | ||||
| Surface plating | Solder mask: Black Green White Red Thickness≥17 um,Block,BGA | |||
| Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | ||||
| Ppeelable mask: red bule thickness≥300 um | ||||
| Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm | ||||
| PCB Type | Single-side pcb , Double side pcb , Multilayer pcb , Aluminum base
PCB HDI board pcb , High Tg pcb and so on |
| Base Material | XPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on |
| Layer No . | 1-18 Layers |
| Surface Finish | HASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink |
| Silk Screening | In any color such as green ,white ,nlue ,red , black and so on |
| Certificate | ISO9001,ISO14001,ISO-TS, UL,ROHS |
| Testing | Electrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test |
| Environment | Clean room environmen , Dust-free workshop |
| Transportation | Fedex ,DHL,UPS and so on |
| Files | Gerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc |
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