Home Companies Shenzhen Chaosheng Electronic Technology Co.,Ltd

Green Multilayer Printed Circuit Board Assembly , Surface Mount PCB Assembly

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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[China] country

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Green Multilayer Printed Circuit Board Assembly , Surface Mount PCB Assembly

Country/Region china
City & Province hong kong hong kong
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Product Details

6-layer FPC production + SMT+TEST+DIP,SMT PCB Service,wooden box,rigid flex pcb manufacturers,high speed pcb layout

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Product Description

 

Specifications

  1.  Our professional engineering team can put your project into production in a short time. Sample pictures and
  2. BOM are needed to make customized products.Also we can supply for the copy of the PCB and PCBA ,so you
  3. just sent me the enquiry is ok ,we can do what you need to do !
  4.  We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured
  5. according to customers' requests or samples. Plastic injection processing available.
  6. Purchasing the electronic components for you to the production of the PCBA
  7. We have advanced equipment for through-hole and SMT DIP COB cable Assembly
  8.  ROHS compliant and lead-free process.
  9.  In-circuit, functional tests& burn-in tests, full system test
  10.  High output to guarantee prompt delivery.

Product Details 

  1. 6-layer FPC production + SMT+TEST+DIP,SMT PCB Service,wooden box,rigid flex pcb manufacturers,high speed pcb layout
  2. FPCBA processing method,Six-layer FPCHDI, laser hole 0.10mm, mobile phone motherboard,
  3. FPC production + it contains SMT, DIP, TEST,

PCB capability and services:

  1.  Single-sided, double-sided & multi-layer PCB (up to 30 layers)
  2.  Flexible PCB (up to 10 layers)
  3.  Rigid-flex PCB (up to 8 layers)
  4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
  5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
  6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
  7. Quantities range from prototype to volume production.
  8. 100% E-Test

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

 

Detailed Specification of PCB Manufacturing

1layer1-30 layer
2Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

Aluminum-based material.

3Board thickness0.2mm-6mm
4Max.finished board size800*508mm
5Min.drilled hole size0.25mm
6min.line width0.075mm(3mil)
7min.line spacing0.075mm(3mil)
8Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

Hard Gold, OSP

9Copper thickness0.5-4.0oz
10Solder mask colorgreen/black/white/red/blue/yellow
11Inner packingVacuum packing,Plastic bag
12Outer packingstandard carton packing
13Hole tolerancePTH:±0.076,NTPH:±0.05
14CertificateUL,ISO9001,ISO14001,ROHS,TS16949
15Profiling punchingRouting,V-CUT,Beveling

 

PCB Assembly services:


Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

 

Testing Methods


AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

 

Detailed Specification of Pcb Assembly

1Type of AssemblySMT and Thru-hole
2Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
3ComponentsPassives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carries/CSP
Double-Sided SMT Assembly
Fine Pitch to 08 Mils
BGA Repair and Reball
Part Removal and Replacement-Same Day Service
3Bare Board SizeSmallest:0.25x0.25 Inches
Largest:20x20 Inches
4File FormatsBill of Materials
Gerber Files
Pick-N-Place File(XYRS)
5Type of ServiceTurn-Key,Partial Turn-Key or Consignment
6Component PackagingCut Tape
Tube
Reels
Loose Parts
7Turn Time15 to 20 days
8TestingAOI inspection
X-Ray inspection
In-Circuit testing
Functional test

 

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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